Publications
2024 | 2023 | 2022 | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003
Year 2012
Papers
| Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants. Solid State Phenomena, 187 (2012) pp 201-205 (ISSN 1012-0394) |
| Blaudeck,T.; Adner,D.; Hermann,S.; Lang,H.; Schulz,S.E.; Gessner,T.: Wafer-level Integration of Functionalized Carbon Nanotubes as Prototypes for Tunable Sensors. MRS Fall Meeting 2012, Boston, 2012 November 25-30 |
| Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. ICNFA, Montreal, 2012 Aug 7-9; Talk |
| Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. Proceedings of the 3rd International Conference on Nanotechnology: Fundamentals and Applications (ISBN 978-0-9867183-3-5) |
| Fiedler,H.; Melzer,M.; Waechtler,T.; Hermann,S.; Schulz,S.E.; Gessner,T.: Nanomaterials for Interconnects. 8th Interregional Workshop on Advanced Nanomaterials (IWAN 2012), Frankfurt (Oder) (Germany), 2012 Nov 12-13 |
| Fiedler,H.; Toader,M.; Hermann,S.; Rennau,M.; Schulz,S.E.; Hietschold,M.; Gessner,T.: Fabrication and characterization of CNT via interconnects for application in integrated circuits. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30; Talk (ISBN Abstract in: Verh. Dtsch. Phys. Ges. (ISSN 0420-0195)) |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Sheremet,E.; Rennau,M.; Schulze,S.; Waechtler,T.; Hietschold,M.; Zahn,D.R.T.; Schulz,S.E.; Gessner,T.: Distinguishing between Individual Contributions to the Via Resistance in Carbon Nanotubes Based Interconnects. ECS Journal of Solid State Science and Technology, 1, 6 (2012) pp M47-M51 (ISSN 2162-8769) |
| Fischer,T.; Prager,L.; Hohage,J.; Ruelke,H.; Schulz,S.E.; Richter,R.; Gessner,T.: A two-step UV curing process for producing high tensile stressed silicon nitride layers. MRS Spring Meeting, San Francisco; 2012 MRS Spring Meeting Proceedings |
| Fischer,T.; Schulz,S.E.; Gessner,T.; Prager,L.; Hohage,J.; Ruelke,H.; Richter,R.: A complimentary study of vacuum ultraviolet curing procedures on high tensile stress SiXNYHZ PECVD silicon nitride layers. JVST:B |
| Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2. Thin Solid Films, 520, 14 (2012) pp 4741-4744 (ISSN 0040-6090) |
| Gessner,T.; Schulz,S.E.; Waechtler,T.; Lang,H.; Jakob,A.: Substrat mit einer Kupfer enthaltenden Beschichtung und Verfahren zu deren Herstellung mittels Atomic Layer Deposition und Verwendung des Verfahrens. Patent, DE 10 2007 058 571 B4 (2012) |
| Gordan,O.D.; Lehmann,D.; Haidu,F.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Lang,H.; Braun,W.; Gessner,T.; Zahn,D.R.T: Copper Oxidation and Reduction: A Combined Ellipsometry and Photoemission Study. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Hartwig,I.; Ecke,R.; Braemer,B.; Auerswald,E.; Schulz,S.E.: Evaluating the adhesion of ultra-thin layers . MSE, Darmstadt(Germany), Sept 25-27; Poster |
| Hermann,S.; Bonitz,J.; Kaufmann,C.; Schulz,S.E.; Gessner,T.; Shaporin,A.; Voigt,S.; Mehner,J.; Hartmann,S.; Wunderle,B.: Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes. Herrenhausen Conference „Downscaling Science“ , Hanover (Germany), 2012 Dec 12-14 |
| Hermann,S.; Fiedler,H.; Loschek,S.; Schulz,S.E.; Gessner,T.: Processes for wafer level integration of carbon nanotubes in electronic and sensor applications. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings (ISBN 9783000391620) |
| Hermann,S.; Fiedler,H.; Yu,H.; Loschek,S.; Bonitz,J.; Schulz,S.E.; Gessner,T.: Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications. Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Systems, Signals and Devices (SSD), 2012 9th International Multi-Conference on (ISBN 978-1-4673-1589-0) |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration in Interconnects and MEMS/NEMS. Advanced metallization conference 2012, Albany, 2012 Oct 9-11; Invited Talk |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Novel form of carbon nanotube films with a self-assembled carbon-metal heterostructure. Vth International Conference on Molecular Materials, Barcelona (Spain), 2012 Jul 03-06 |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration beyond CMOS and MEMS/NEMS. INC8 - International Nanotechnology Conference on Communication and Cooperation, Tsukuba; invited Talk, 2012 May 8-11 |
| Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schaefer,P.; Zahn,DRT; Albrecht,M.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure. Carbon, 50, 13 (2012) pp 4765-4772 (ISSN 0008-6223) |
| Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schulz,S.E.; Gessner,T.: Novel carbon nanotube film with a self-assembled carbon-metal heterostructure. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27 |
| Loschek,S.; Hermann,S.; Haibo,Y.; Schulz,S.E.: Structuring of carbon nanotubes for field emission based movement sensors. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz (Germany), 2012 March 20-23 (ISBN 978-1-4673-1589-0) |
| Loschek,S.; Hermann,S.; Haibo,Y.; Schulz,S.E.: Field emitting carbon nanotubes in MEMS-structures for movement sensors. 11. Chemnitzer Fachtagung Mikrosystemtechnik , Chemnitz (Germany), 2012 Oct 23-24 (ISBN 978-3-00-039162-0) |
| Melzer,M.; Foerster,A.; Waechtler,T.; Wagner,C.; Fiedler,H.; Schuster,J.; Hermann,S.; Schulz,S.E.; Gessner,T.: Controlling the growth morphology of ALD copper oxide on CNTs by thermal oxidation prior to the ALD. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20 |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Variation of the growth behavior of copper oxide deposited via ALD on thermally pretreated CNTs. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30 |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Copper oxide ALD on thermally pretreated CNTs for interconnect applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Schulz,S.E.; Lang,H.; Zahn,D.R.T.; Gessner,T.: An Approach for Cu ALD on Co/Ni as Liners for ULSI Interconnects and Magnetic Film Systems for Spintronic Applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Rodriguez,R.D.; Toader,M.; Hermann,S.; Mueller,S.; Gordan,O.D.; Yu,H.; Schulz,S.E.; Hietschold,M.; Zahn,D.R.T.: Nanoscale Optical and Electrical Characterization of Aligned Semiconducting Single-Walled Carbon Nanotubes in a Field Effect Transistor. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27 |
| Salvan,G.; Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Schubert,C.; Albrecht,M.; Zahn,D.R.T.: Magneto-optical Kerr Effect Studies of Heterostructures of Ferromagnetic and Copper Oxide Layers Produced by Atomic Layer Deposition. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Salvan,G.; Fronk,M.; Robaschik,P.; Zahn,D.R.T.; Albrecht,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.: Heterostructures of Copper Oxide Layers Produced by ALD with Ferromagnetic Layers Studied by Magneto-Optical Kerr Effect Spectroscopy. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20 |
| Schmeisser,M.; Schuster,J.; Schulz,S.E.; Auer,A.: Quantum chemical modeling of basic reaction steps for the reduction of ALD-grown copper oxide films. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden, 2012 June 17-20; Poster |
| Schuster,J.; Mohammadzadeh,S.; Streiter,R.; Wagner,C.; Zienert,A.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Nanodevices. Nanofair 2012, Dresden, June 13; Talk |
| Schuster,J.; Schulz,S.E.; Herrmann,T.; Richter,R.: Modeling and Simulation of the Interplay between Contact Metallization and Stress Liner Technologies for Strained Silicon. Materials for Advanced Metallization Conference (MAM), Grenoble, 2012 Mar 11-14; Talk, Book of Abstracts |
| Schuster,J.; Streiter,R.; Wolf,H.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Equipment and Processes for the Deposition of Thin Films . SEMICON Europa , Dresden, Oct 9-11; Talk |
| Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Poster presentation; Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Toader,M.; Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.; Hietschold,M.:International Confererence on Superlattices, Nanostructures and Nanodevices, Dresden (Germany), 2012 Jul 22-27 |
| Toader,M.; Fiedler,H.; Schulz,S.E.; Hietschold,M.: Conductive AFM for CNTs characterisation. DPG Frühjahrstagung, Berlin, 2012 Mar 25-30; Poster |
| Waechtler,T.; Auerswald,E.; Hoebelt,I.; Nowack,M.; Noack,E.; Gollhardt,A.; Vogel,D.; Michel,B.; Schulz,S.E.; Gessner,T.: FIB/SEM Analysis for Smart Systems Integration. Smart Systems Integration (SSI 2012), Zürich (Switzerland), 2012 Mar 21-22 |
| Waechtler,T.; Mueller,S.; Fiedler,H.; Melzer,M.; Schulz,S.E.; Gessner,T.: ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks. EFDS Workshop on Atomic Layer Deposition, Dresden (Germany), 2012 Mar 7 |
| Wagner,C.; Hartmann,S.; Schuster,J.; Wunderle,B.; Schulz,S.E.; Gessner,T.: Nanomechanics of CNTs for Sensor Simulation. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Talk; Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Wagner,C.; Schuster,J.; Hartmann,Steffen; Wunderle,B.; Schulz,S.E.; Gessner,T.: Nanomechanics of CNTs for Sensor Application. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Talk, Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Zimmermann,S.; Ahner,N.; Fischer,T.; Oszinda,T.; Uhlig,B.; Schulz,S.E.; Gessner,T.: A Low Damage Patterning Scheme for Ultra Low-k Dielectrics. Future Fab International, vol. 42 (2012) pp 94-101 |
