Publications
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Year 2017
Papers
| Blaudeck,T.; Hermann,S.; Hartmann,M.; Boettger,S.; Tittmann-Otto,J.; Heldt,G.; Reuter,D.; Schulz,S.E.: Scalable Fabrication of Carbon Nanotube Field-Effect Transistors. New Directions in Biocomputation, Dresden, 2017 Sep 12-13; Abstract Book, pp 37-38 |
| Buerger,D.; Rayapati,V.R.; Du,N.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Electroforming-free memristive switching in YMnO3 thin films with Al top electrodes with 10^6 Roff/Ron ratio. Advanced Metallization Conference 2017 (AMC), Austin, Texas (USA), 2017 Sep 13-14; Poster |
| Du,N.; Buerger,D.; Skorupa,I.; Schmidt,O.G.; Schulz,S.E.; Schmidt,H.: Resistive switching dynamics in memristive BiFeO3 with metallic top and bottom electrodes. Materials for Advanced Metallization (MAM), Dresden (Germany), 2017 Mar 26-29; Poster |
| Du,N.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,H.: Resistive switching dynamics in memristive BiFeO3 device. Workshop „Materialien für nichtflüchtige Speicher“, Mainz (Germany), 2017 Jun 26; Talk |
| Du,N.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,H.: Resistive switching in memristive BiFeO3 devices. EMN Meeting on Memristive Switching & Network, Mailand (Italien), 2017 Aug 14-18; Talk |
| Georgi,C.; Melzer,M.; Bankwitz,J.; Nichenametla,C.K.; Lang,H.; Schulz,S.E.: Thermal ALD of metallic copper on cobalt for advanced interconnects. MAM2017 – Materials for Advanced Metallization Conference, Dresden (Germany), 2017 March 26-29 |
| Georgi,C.; Melzer,M.; Nichenametla,C.K.; Lang,H.; Schulz,S.E.: Low-temperature chemical vapor deposition of cobalt oxide from a novel dicobaltatetrahedrane precursor. Joint EuroCVD-21 BalticALD-15, Linköping (Sweden), 2017 June 11-14 |
| Hartmann,M.; Toader,M.; Schubel,R.; Jordan,R.; Schulz,S.E.; Hermann,S.: Performance enhancement of carbon nanotube FETs via polymer-based doping control. Trends in Nanotechnology (TNT), Dresden (Germany), 2017 June 5-9; Talk |
| Hofmann,L.; Reuter,D.; Schubert,I.; Wuensch,D.; Rennau,M.; Ecke,R.; Vogel,K.; Gottfried,K.; Schulz,S.E.; Gessner,T.: 3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages. Journal of Surface Mount Technology, 30, 1 (2017) pp 1-8 |
| Hofmann,L.; Reuter,D.; Wuensch,D.; Hiller,K.; Schulz,S.E.: Emerging 3D integration technologies for MEMS fabrication (invited talk) . MEMS Manufacturing, Santa Clara (USA), 2017 Aug 2-3; Proceedings |
| Hofmann,L.; Zienert,A.; Schuster,J.; Schulz,S.E.: Elektrochemische Pulsstromabscheidung von Kupfer für Si-Durchkontakte in MEMS: Experiment und Simulation. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, p 4 (ISBN 978-3-8007-4491-6) |
| Hu,X.; Schuster,J.; Schulz,S.E.: Reactive molecular dynamics simulations of metallic Cu and Cu oxides ALD. Joint EuroCVD-21 BalticALD-15, Linkoping, 2017 June 11-14 |
| Hu,X.; Schuster,J.; Schulz,S.E.: Reactive dynamics simulation of metallic Cu and Cu oxide ALD from the (nBu3P)2Cu(acac) precursor. Material for Advanced Metallization (MAM), Dresden, 2017 Mar 26-29 |
| Hu,X.; Schuster,J.; Schulz,S.E.: Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper. The Journal of Physical Chemistry C, 121, 50 (2017) pp 28077-28089 |
| Jaeckel,L.; Schuster,J.; Schulz,S.E.: Optimization of ALD processes using computational fluid dynamics simulations. Joint EuroCVD 21 - BalticALD 15, Linköping (Schweden), 2017 June 11-14; Poster presentation |
| Jafarpour,S.; Kini.M; Hermann,S.; Schulz,S.E.: Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes. Microelectronic Eng., 176 (2017) p 95–104 |
| Joseph,T; Fuchs,F.; Schuster,J.; Schulz,S.E.: Electronic Structure Simulation of Thin Silicon Layers: Impact of Orientation, Confinement, and Strain. Material for Advanced Metallization (MAM), Dresden, 2017 Mar 26-29; Poster |
| Kiani,M.; Du,N.; Mayr,C.G.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: Memristive BFO with metallic electrodes as artificial synapse in machine learning circuits. Materials for Advanced Metallization (MAM), Dresden (Germany), 2017 Mar 26-29; Talk |
| Kiani,M.; Du,N.; Mayr,C.G.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: Memristive BFO as artificial synapse in machine learning circuits. Workshop „Materialien für nichtflüchtige Speicher“, Mainz (Germany), 2017 Jun 26; Talk |
| Kiani,M.; Du,N.; Mayr,C.G.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: BFO based memristor as artificial synapse in machine learning circuits. DPG Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Poster |
| Koehler,N.; Liedke,M.O.; Attallah,A.G.; Butterling,M.; Anwand,W.; Wagner,A.; Krause-Rehberg,R.; Schulz,S.E.: Investigation of pore and network formation in spin-on ultra low-k dielectrics by spectroscopic techniques. Advanced Metallization Conference, Austin, TX (USA), Sept. 13-14; Poster presentation |
| Liedke,M.O.; Koehler,N.; Butterling,M.; Attallah,A.G.; Krause-Rehberg,R.; Hirschmann,E.; Schulz,S.E.; Wagner,A.: In-situ investigations of the curing process in ultra low-k materials. 12th International Workshop on Positron and Positronium Chemistry, Lublin (Poland), Aug. 28 - Sept. 1; Talk |
| Lorenz,E.; Schuster,J.; Schulz,S.E.: Multiscale Simulation of Barrier/Seed PVD. MAM, Dresden (Germany), 2017 Mar 26-39; Materials for Advanced Metallization (MAM); Talk |
| Lorenz,E.; Wislicenus,M.; Uhlig,B.; Schuster,J.; Schulz,S.E.; Preusse,A.: Multiscale simulation methods for the optimization of BEOL metallization processes. 2017 Advanced Metallization Conference; Poster |
| Matthes,P.; Almeida,M.; Ecke,R.; Schulz,S.E.: Magnetfeldsensorik: Dünnschichttechnologien und Anwendungsbereiche. Dünnschichtsysteme für MEMS und Sensoren, Renningen (Deutschland), 2017 Apr 26-27; Vortrag |
| Melzer,M.; Charan K.Nichenametla; Colin Georgi; Heinrich Lang; Schulz,S.E.: Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor. RSC Advances, 7 (2017) pp 50269-50278 |
| Rayapati,V.R.; Bogusz,A.; Du,N.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: Nonvolatile resistive switching to 10^6 OFF/ON resistance ratio in yttrium manganite thin films with downscaled top electrodes. DPG-Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk |
| Selbmann,F.; Hofmann,L.; Baum,M.; Roscher,F.; Wiemer,M.; Schulz,S.E.; Joseph,Y.; Otto,T.: Parylene as a dielectric material for MEMS applications. Materials for Advanced Metallization (MAM), Dresden, Mar. 26-29; Proceedings |
| Sophia Dempwolf; Hofmann,L.; Christopher Bowers; Daniela Guenther; Roy Knechtel; Schulz,S.E.; Ronny Gerbach: Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors. International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo (Japan), 2017 May 16-18; Proceedings |
| Tittmann-Otto,J.; Hartmann,M.; Ullrich,J.; Schulz,S.E.; Hermann,S.: Charge traps in carbon nanotube-based field-effect transistors. Workshop on Charge Trappung Defects in Semiconductors and Insulators, York, UK, 2017 Mar 20-21; Proceedings, 2017 (2017) p 24 |
| Zienert,A.; Hofmann,L.; Schuster,J.; Schulz,S.E.: TSV Metallization without Additives by Periodic Pulse Reverse Plating. 2017 Advanced Metallization Conference (AMC), Austin (TX), 2017 Sep 13-14; Oral Presentation |
