Honor for research from Chemnitz
Scientist of the International Research Training Group “Materials and Concepts for Advanced Interconnects and Nanosystems” received the best poster award at ALD 2014 in Kyoto, Japan
On the AVS Topical Conference on Atomic Layer Deposition 2014 (ALD 2014), Xiao Hu received the best poster award for his poster “ALD of copper oxide from (nBu3P)2Cu(acac) and wet O2: a theoretical study”. More than 200 posters have been presented at the conference. The ALD conference is a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films. In every year since 2001, the conference had been held alternatively in the United States, Europe, and Asia.
Worldwide, Atomic Layer Deposition (ALD) is used to fabricate ultrathin and conformal thin film structures for many semiconductor and thin film device applications. Within the International Research Training Group “Materials and Concepts for Advanced Interconnects and Nanosystems” multiscale modeling and simulation of atomic layer deposition, and calculation of electronic properties of nanoscale devices is done.
Xiao Hu has been working on this project since 2012 as a PhD student. Cuprous oxide (Cu2O) thin films have a wide variety of applications, including semiconductor microelectronics, photoelectrochemical cells, catalysis and gas sensors. Atomic layer deposition (ALD), which is based on sequential self-limiting surface reactions, is a promising method for making uniform and conformal thin films. The work is focused on the surface chemistry of Cu2O ALD. They propose a new reaction mechanism for Cu2O ALD by means of thermodynamic modeling and molecular dynamic simulations.
(Authors: Dr. Martina Vogel and Xiao Hu)