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Professorship of Power Electronics
Equipment

Equipment

At the professorship, there are numerous test benches and measuring devices available for research and education.

Aside from than the listed devices and test benches here, further possibilities are being provided to us in collaboration with our partners to be able to offer a variety of investigations in the field of research and as a service provider.

Note for externals: The provided possibilities seem to be insufficient for your matter?

Please contact us - most likely we will find a solution that suits your concerns.
Test bench for high voltages up to 6 kV
Feasible
Measurements
Short-Circuit (I,II,III) | Double Pulse | frequent Switching
Technische
Highlights
  • Intermediate circuit voltage up to 6 kV possible
  • Variable parasitic inductances through flexible setups
  • Measurements at room temperature and at increased temperatures possible
  • Measurements with up to 4 channels, 12Bit, 2 GHz and 2,5 GSa possible
  • Reliable measurement of power devices on DCB substrate
  • Control system and safety precautions ensure executing without possible personal injuries.
Overview of the available power cycling test benches
Feasible
Measurements
Accelerated lifetime investigations|
Thermal impedance measurements
Technical
Highlights
  • 15 test benches available
  • Up to 2000 A possible
  • Flexible programming and measuring of relevant parameters due to desired test strategy
  • Felixble measurement time periods and measurement delays
  • Modular and adaptable setup for every package
  • Measurements of up to 15 devices simultaneously
  • Passive and active switching in power cycling possible
  • Constant increase in possibilities in the planning:
    • Automated threshold voltage measurement
    • Digital control and monitoring of gate voltage
    • Monitoring of heatsink flow through
Gate-Stress-Test - HTGB
Feasible
Measurements
Stepped Gate-Stress-Tests
Technical
Highlights
  • Automatic and online Gate-leakage-current measurement
  • Free programmable steps
  • Measurement of 100 devices at once possible
High temperature reverse bias - HTRB
Feasible
Measurements
High Temperature Reverse Bias - HTRB
Technical
Highlights
  • Continuous leakage-current measurment
  • Testcondition at 150°C
  • Test with 80V or up to 6,5kV
  • Maximum 20 devices under test (dependent on module size)
High humidity, high temperature, high voltage reverse bias test - H3TRB
Feasible
Measurements
High humidity, high temperature, high voltage reverse bias test - H3TRB
Technical
Highlights
  • Continuous leakage-current measurment
  • Testcondition at 80°C and 85% relative humidity
  • Test with 80V or up to 6,5kV
  • Maximum 20 devices under test (dependent on module size)
Quantitative bond wire tester
Feasible
Measurements
Bond wire pluck test with qualitative and quantitative significance
Technical
Highlights
  • Adjustment to different types of cases possible
  • Precise digital measurement with a resolution of 0.01 N
Microscope
Feasible
Measurements
Defect image analysis | Inspection of aging signs
Technical
Highlights
  • Digital editing and creating of panoramic images
  • Creating of 3D-depths images
  • Magnification with zoom up to 2500 times
Ultra Sonic Microscopy
Feasible
Measurements
Non-destructive failure investigation | Detektion of traces of ageing and damages
Technical
Highlights
  • Different resolutions and penetrations with different high frequency probes
  • Various scanning modes enable investigations for different room regions (vertical, horizontal, tilted)
  • Programmable control and automatic localization enable high reproducability
  • Predesigned assambly for all commercially available power electronic packages
Available software, servers and computational power
Available
Software
  • FEM-Simulationen
    • ANSYS
    • TCAD
  • PCB Design
    • Eagle
  • Electrical Circuit Simulation
    • LTSpice
    • SiMetrix
    • Portunus
  • Testbench Controlling
    • LabView
    • Arduino
Technical
Highlights
  • Optimized servers for ANSYS simulations
    • Up to 16 parallel cores and 128 GB RAM
  • Optimized servers for 2D and 3D TCAD simulations
    • Up to 32 parallel cores, 128 GB RAM and 3,7 GHz with Thread Ripper