iREL 4.0 (ECSEL Innovation Actions Calls 2019)

Reliability for heterogeneous system integration for industry 4.0 Reliability and quality offensive of the European industry with regard to packaging.

TU Chemnitz: Cooperation with Infineon and AMS regarding lifetime modeling, failure analysis and accelerated testing. Focus: Sintered silver and copper interconnects, encapsulation, failure analysis

KI-LiDAR

Digital twin and neural networks for recalibration of Automotive Flash-LiDAR, field coupled simulation and validation.

Landesinnovationspromotion

Transient IR-optical & AI-based methods for inline failure analysis and quality control of microelectronic packages during manufacturing.

HiPER (PENTA Call 3: Transport and Smart Mobility)

Thermal management and reliability of GPU power-SiP for automotive HPC for autonomous driving, liquid cooling test bench, design, setup, test and simulation power-SiP, power management GPU mock-up control and test

Transferzentrum "MoHeSys"

Modular integration for thin & heterogeneous sensor systems, characterisation of heterogeneous thin film and multilayer systems and reliability evaluation, structure-property correlation of thin films

Inlinetest (ICT-31-2017-IA)

Thermographic methods for inline process monitoring in the production of power electronics: Focus MMIC (GaN-HPA), discretes

Nachwuchsforschergruppe "e-Pisa"

Energy-autonomous, wireless piezoelectric MEMS sensors and actuators in medical technology and industry 4.0; design, construction and test of AlN-based cantilever as fatigue platform for thin sensor layers under vibration load, functionality.

Landesinnovationspromotion

Thermo-mechanical characterisation and reliability of flexible sensor systems, structure-property correlation in fatigue or disruption of thin Al and Cu PVD coatings by accelerated stress tests

Leistungszentrum 'Functional integration for micro-/nanoelectronics'

Thermo-mechanical characterization and reliability of 3D WL-SiP structures

Partner and coordinator TU Chemnitz

Nanoproxi (KMU-innovativ: Nanotechnologie NanoChance): 'Development of a thermal delamination detection method'

Development of a thermal pixel camera for in-situ detection of delamination.

DFG Research Unit FOR1713, Sensorische Mikro- und Nanosysteme (SMINT, part II). Teilprojekt: "Ermüdungstest-plattform zur Zuverlässigkeitsbewertung von Nanokomponenten"

Characterisation of materials on the micro- and nanoscale using MEMS loading devices.

Sub-project manager

CarrICool (FP7-ICT-2013-11-small): "Modular Interposer architecture providing scalable heat removal, power delivery, and communication"

Thermo-mechanical characterisation of 3D architectures in Si-interposer, e.g. TSVs and CuSn-based joining-technologies (soldering, TLPB)

Workpackage Leader

Piezoresistive carbon nanotubes for condition monitoring and reliability consideration (Part II)

Degradation of SWCNT-metal interfaces in simulation and experiment (in situ TEM actuation & DIC analysis).

Sub-project manager

NanoTherm (FP7-ICT-2011.3.1-large): "Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces"

Characterisation, modelling and failure analysis of porous sintered silver and Epoxy-Ag-Composites as die attach for power applications

Workpackage Leader

SmartPower (FP7-ICT-2011-7-large): "Smart integration of GaN & SiC high power electronics for industrial and RF applications"

1: System approach to double-sided cooling of power converter using TEC and transient thermal buffering.

2: RF-Power-SiP under thermo-mechanical loading, characterisation and lifetime evaluation.

Workpackage Leader

HyperConnect (FP7-NMP-2012-SMALL-6): "Functional joining of dissimilar materials using directed self-assembly of nanoparticles by capillary-bridging"

Self-assembly and interdiffusion using nano-materials, deformation and failure mechanisms of sintered joints und thermos-mechanical loading

Workpackage Leader

DFG Research Unit FOR1713: Sensorische Mikro- und Nanosysteme (SMINT, part I).

Entwicklung und Charakterisierung einer MEMS-Belastungsvorrichtung

Teilprojektleiter

Integration of dielectrophoretic deposited Carbon Nanotubes and their reliability in mechanical sensor systems (Part I)

Structure-property correlation for SWCNTs during pullout testing from a metal matrix for smart systems application.

Teilprojektleiter

eBRAINS (FP7-ICT-2009-5-large): "Best-Reliable Ambient Intelligent Nano Sensor Systems"

Characterisation of TSVs and CuSn Joints for 3D-SiP technologies. High cycle fatigue of thin Al BEOL layers under isothermal vibration loading

Nanett (Phase II): "Kompetenznetzwerk für Nanosystemintegration - Materialintegrierte Sensorik basierend auf Nanoeffekten"

Materialcharakterisierung, Simulation und Test eines Polymer-verkapselten piezo-resistiven Bewegungssensors aus PVDF.

Partner

Nanett (Phase I): "Kompetenznetzwerk für Nanosystemintegration - Materialintegrierte Sensorik basierend auf Nanoeffekten"

Simulation und Charakterisierung des Aufrollverhaltens von nanoskaligen TiCr Smart Tubes während der Prozessierung.

Partner