Publikationen
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Jahr 2024
| Bickmann,C.; Meinecke,C.; Korten,T.; Sekulla,H.; Helke,C.; Blaudeck,T.; Reuter,D.; Schulz,S.E.: Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces. Micro and Nano Engineering, 23, 100265 (2024) pp 1-5 |
| Braun,S.; Wiemer,M.; Schulz,S.E.: Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level. Micromachines, 15, 746 (2024) pp 1-18 |
| Cirulis,I.; Kalangi,D.S.; Dubey,V.; Franz,M.; Wuensch,D.; Braun,S.; Haase,M.; Wiemer,M.; Schulz,S.E.: Fine Pitch Aluminum Hybrid Bonding: Overcoming the Challenges in Plating, Passivation and Bonding. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, 2024 Sep 11-13 |
| Diex,K.; Jaeckel,T.; Dubey,V.; Wuensch,D.; Vogel,K.; Bonitz,J.; Hanisch,A.; Wiemer,M.; Schulz,S.E.: Investigations on Low-Temperature Aluminium Thermocompression Bonding Using Surface Passivation Technique. IEEE, Nara, Japan, 2024 Oct 30 - Nov 01 |
| Diex,K.; Jaeckel,T.; Wuensch,D.; Vogel,K.; Bonitz,J.; Hanisch,A.; Wiemer,M.; Schulz,S.E.: Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration. 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg (Germany), 2024 Apr 16-18; Proceedings (ISBN 979-8-3503-8877-0, 979-8-3503-8878-7) |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Fischer,T.; Helke,C.; Haase,M.; Hanisch,A.; Hofmann,L.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding. 10th Electronics System-Integration Technology Conference (ESTC), Berlin (Germany), 2024 Sep 11-13; Proceedings, pp 1-5 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis. ECS Journal of Solid State Science and Technology, 13, 10 (2024) |
| Franz,M.; Jaeckel,L.; Kassner,L.; Thurm,C.; Daniel,M.; Stahr,F.; Schulz,S.E.: Poster - Process Development of Cobalt Metal ALD on a Novel ALD Reactor. ALD/ALE 2024, Helsinki, 2024 Aug; Zenodo |
| Huber,M.; Hu,X.; Zienert,A.; Schuster,J.; Schulz,S.E.: Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing. The Journal of Chemical Physics, 157, 8 (2024) (ISBN 0021-9606, 1089-7690) |
| Monakhov,K.Y.; Meinecke,C.; Moors,M.; Schmitz-Antoniak,C.; Blaudeck,T.; Hann,J.; Bickmann,C.; Reuter,D.; Otto,T.; Schulz,S.E.; Parala,H.; Devi,A.: Molecular approach to semiconductors: a shift towards ecofriendly manufacturing and neuroinspired interfaces. Pure and Applied Chemistry, 96, 9 (2024) pp 1313-1331 |
| Richter,D.; Wuensch,D.; Dubey,V.; Stoll,F.; Wuensch,D.; Schulz,S.E.: Low Temperature LiTaO3-to-Si Wafer Bonding. IEEE, Nara, Japan, 2024 Oct 30 - Nov 01 |
| Richter,D.; Wuensch,D.; Markert,M.; Hanisch,A.; Dubey,V.; Stoll,F.; Wiemer,M.; Schulz,S.E.: Low Temperature Bonding of Heterogeneous Material using LiTaO3/Si, and LiTaO3/Glass. Smart Systems Integration , Hamburg, 2024 Apr 16-18 |
| Schaller,F.; Selbmann,F.; Song,S.; Zimmermann,S.; Roscher,F.; Schulz,S.E.; Kuhn,H.: Parylene C as a memristive material for biocompatible memory and synaptic devices. 31st Materials for Advanced Metallization Conference (MAM), Milan (Italy), 2024 Mar 18-21 |
