Publikationen
2026 | 2025 | 2024 | 2023 | 2022 | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003
Jahr 2013
| Baum,M.; Hofmann,L.; Wiemer,M.; Schulz,S.E.; Gessner,T.: Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding. Semiconductor Conference Dresden-Grenoble (ISCDG), Dresden, 2013 Sep 26-27; Proceedings (ISBN 978-1-4799-1250-6) |
| Blaudeck,T.; Adner,David; Hermann,S.; Schulz,S.E.; Lang,Heinrich; Gessner,T.: Functionalization of Single-Walled Carbon Nanotubes and their Integration on Wafer Level. NT13, Espoo (Finnland), 24.-28. Juni 2013 |
| Dhakal,D.; Waechtler,T.; Melzer,M.; Mothes,R.; Schulz,S.E.; Lang,H.; Gessner,T.: In-situ XPS investigation of the surface chemistry of a Cu(I) Beta-Diketonate precursor with reference to the ALD of Cu2O. 17. Tagung Festkörperanalytik (FKA 17), Chemnitz (Deutschland), 2013 Jul 1-3 |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Evegniya,S.; Rennau,M.; Schulze,S.; Waechtler,T.; Zahn,D.R.T.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Electrical properties of Carbon Nanotube Interconnects. MAM, Leuven (Belgium), 2013 Mar 10-13; Poster |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Evegniya,S.; Rennau,M.; Schulze,S.; Waechtler,T.; Zahn,D.R.T.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Preparation and Characterization of Carbon Nanotubes based Via Interconnects. INC 9, Berlin(Germany), 2013 May 14-17; Poster |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Evegniya,S.; Rennau,M.; Schulze,S.; Waechtler,T.; Zahn,D.R.T.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Low resistance carbon nanotube - metal contact for interconnect applications. NT, Helsinki(Finland), 2013 Jun 24-28; Poster |
| Hartwig,I.; Braemer,B.; Hecker,M.; Schulz,S.E.: Effects of sandwich thickness asymmetry on interface toughness measurement in the 4-point bending test. MAM, Leuven(Belgium), Mar 10-13; Poster |
| Hofmann,L.; Baum,M.; Gottfried,K.; Schulz,S.E.; Wiemer,M.; Gessner,T.: TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS. Mikrosystemtechnik-Kongress, Aachen, 2013 Oct 14-16; Proceedings (ISBN 978-3-8007-3555-6 ) |
| Hofmann,L.; Baum,M.; Schulz,S.E.; Wiemer,M.; Gessner,T.: 3D Integration Technologies for MEMS based on Copper TSVs and Copper-to-Copper Metal Thermo Compression Bonding. Advanced metallization conference 2013, Albany, 2013 Oct 21-23; Talk |
| Hofmann,L.; Baum,M.; Schulz,S.E.; Wiemer,M.; Gessner,T.: 3D technologies for integration of MEMS . SEMICON Europa , Dresden, Oct 8-10; Talk |
| Hofmann,L.; Schubert,I.; Ecke,R.; Gottfried,K.; Schulz,S.E.; Gessner,T.: Vertical Integration techniques for MEMS using HAR TSV. Smart Systems Integration, Amsterdam(NL), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Hofmann,L.; Schubert,I.; Gottfried,K.; Schulz,S.E.; Gessner,T.: Investigations on partially filled HAR TSVs for MEMS applications. Interconnect Technology Conference (IITC), Kyoto(Japan), 2013 Jun 13-15; Proceedings (ISBN 978-1-4799-0438-9 ) |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Zahn,D.R.T.; Hietschold,M.; Lang,H.; Gessner,T.: Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications. Microelectron. Eng., 107 (2013) pp 223-228 (ISSN 0167-9317) |
| Salvan,G.; Robaschik,P.; Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Schubert,C.; Thomas,S.; Albrecht,M.; Zahn,D.R.T.: Magneto-optical Kerr effect studies of Cu2O/nickel heterostructures. Microelectron. Eng., 107 (2013) pp 130-133 (ISSN 0167-9317) |
| Schuster,J.; Schulz,S.E.; Herrmann,T.; Richter,R.: Modeling and Simulation of the Interplay between Contact Metallization and Stress Liner Technologies for Strained Silicon. Microelectronic Eng., 107 (2013) pp 161-166 |
| Shaporin,A.; Hermann,S.; Kaufmann,C.; Schulz,S.E.; Gessner,T.; Voigt,S.; Mehner,J.; Hartmann,S.; Wunderle,B.; Bonitz,J.: Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes. Smart Systems Integration Conference 2013 (SSI), Amsterdam (The Netherlands), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Tittmann,J.; Hermann,S.; Fiedler,H.; Schulz,S.E.; Gessner,T.: Manipulation of Ni catalyst particle size, shape and areal density on TiN support layer for growth of vertical aligned CNTs. NT13, Fourteenth International Conference on the Science and Application of Nanotubes, Aalto University, Helsinki (Finland), June 24-28; Proceedings, p 76 |
| Toader,M.; Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.; Hietschold,M.: Conductive AFM for CNT characterization. Nanoscale Research Letters, 8, 1 (2013) p 24 |
| Waechtler,T.; Dhakal,D.; Melzer,M.; Sharma,A.; Gummenscheimer,A.; Ahner,N.; Hermann,S.; Fiedler,H.; Schulz,S.E.; Gessner,T.: ALD of Transition Metals and Metal Oxides for Applications in Electronics and Sensor Devices. Symposium of the ALD Lab Dresden @ SEMICON Europa 2013, Dresden (Germany), 2013 Oct 8 |
| Waechtler,T.; Sharma,A.; Ahner,N.; Melzer,M.; Mueller,S.; Gummenscheimer,A.; Lehmann,D.; Schaefer,P.; Schulze,S.; Schulz,S.E.; Zahn,D.R.T.; Hietschold,M.; Gessner,T.: ALD of Nickel Oxide and Its Reduction to Nickel for Potential Applications in Interconnects and Spintronics. AVS 13th International Conference on Atomic Layer Deposition (ALD 2013), San Diego, CA (USA), 2013 Jul 29-31 |
