Publikationen
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Jahr 2023
| Dubey,V.; Wuensch,D.; Gottfried,K.; Kinner,R.; Suroshe,R.; Kuechler,M.; Stephan,R.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), Singapore, 2023 Dec 5-8; IEEE Xplore, pp 469-473 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Wiemer,M.; Fischer,T.; Hanisch,A.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Schulz,S.E.; Ghosal,S.; Hofmann,L.: Process and Design Challenges for Hybrid Bonding. ESC Transaction, 112, 3 (2023) pp 73-81 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Wiemer,M.; Fischer,T.; Schermer,S.; Helke,C.; Haase,M.; Ghosal,S.; Hanisch,A.; Bonitz,J.; Lou-Hofmann,J.; Hofmann,L.; Vogel,K.; Schulz,S.E.: Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023 May 30 - June 02 pp 795-799 |
| Franz,M.; Daniel,M.; Xiao,H.; Schulz,S.E.: Poster: Development of a Cobalt Atomic Layer Deposition Process using Co2(CO)6HC≡CC5H11 as Precursor. EUROCVD/Baltic ALD 2023, Leuven, 29.5.-02.06.2023; Zenodo |
| Franz,M.; Junghans,R.; Schulz,S.E.: Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching. 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden, 22.-25.05.2023; Proceedings of the IEEE ... International Interconnect Technology Conference., pp 1-3 (ISSN 2380-6338) |
| Franz,M.; Junghans,R.; Schulz,S.E.: Poster: Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching - MACE. 2023 IEEE International Interconnect Technology Conference (IITC) & IEEE Materials for Advanced Metallization Conference (MAM), Dresden, 22.-25.05.2023; Zenodo |
| Franz,M.; Safian Jouzdani,M.; Kassner,L.; Daniel,M.; Stahr,F.; Schulz,S.E.: Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor. Beilstein Journal of Nanotechnology, 14 (2023) pp 951-963 (ISSN 2190-4286) |
| Manoharan,G.; Hann,J.; Selyshchev,O.; Mamidi,S.; Schulz,S.E.; Zahn,D.R.T.; Blaudeck,T.; Otto,T.: Force-controlled micropipetting as a tool for structured deposition of quantum dots from aqueous dispersions. International Conference and Exhibition on Smart Systems Integration SSI, Bruges (Belgium), 2023 Mar 28-30; Proceedings of the Smart Systems Integration Conference and exhibition, pp 60-64 (ISBN 979-8-3503-0231-8) |
| Meinecke,C.; Heldt,G.; Blaudeck,T.; Lindberg,F.W.; van Delft,F.C.M.J.M.; Rahman,M.A.; Salhotra,A.; Mansson,A.; Linke,H.; Korten.T.; Diez,S.; Reuter,D.; Schulz,S.E.: Nanolithographic Fabrication Technologies for Network-Based Biocomputation Devices. Materials, 16, 1 (2023) |
| Scharf,S.; Notz,S.; Abdeldayem,M.; Thomas,R.; Weber,M.; Mehring,M.; Franz,M.; Rittrich,D.; Schulz,S.E.; Lang,H.: Alkaline earth metal and lanthanide ethylene glycol carboxylates for metal oxide layer formation by spin coating. Materials Chemistry and Physics, 301 (2023) p 127634 (ISSN 0254-0584) |
