| Ahner,N.; Schulz,S.E.; Blaschta,F.; Rennau,M.: Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics. Materials for Advanced Metallization - MAM, Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84 (2007) pp 2606-2609 (ISSN 0167-9317) |
| Ecke,R.; Rennau,M.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Influence of barrier crystallization on CV characteristics of MIS structures. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 123-128 (ISBN 1-55899-865-9 / ISSN 1048-0854) |
| Fruehauf,S.; Gessner,T.; Haase,T.; Jakob,A.; Kohse-Hoeinghaus,K.; Lang,H.; Schulz,S.E.; Waechtler,T.: Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 531-533 (ISBN 978-3-8007-3009-4) |
| Gottfried,K.; Schubert,I.; Schulze,K.; Schulz,S.E.; Gessner,T.: CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices. ICPT - International Conference on Planarization/CMP Technology, Dresden (Germany), 2007, Oct 25-27 pp 297-302 (ISBN 9783800730650) |
| Hofmann,L.; Kuechler,M.; Gumprecht,T.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias
by copper electro depostition (Talk). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Iacopi,F.; Beyer,G.; Travaly,Y.; Waldfried,C.; Gage,D.M.; Dauskardt,R.H.; Houthoofd,K.; Jacobs,P.; Adriaensens,P.; Schulze,K.; Schulz,S.E.; List,S.; Carlotti,G.: Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure. Acta Materialia, 55(4) (2007) pp 1407-1414 |
| Roth,N.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane copper(I) complexes as CVD precursors. Surf. Coat. Technol., 201 (22-23) (2007) pp 9089-9094 (ISSN 0257-8972) |
| Schulz,S.E.; Ahner,N.: Deposition and properties of porous ultra-low-k dielectric films (Invited Talk). 8th Seminar Porous Glasses - Special Glasses, Wroclaw, 2007 Sept 4-8 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Impact of Dielectric Material and Metal Arrangement on Thermal Behaviour of Interconnect Systems. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 445-451 (ISBN 1-55899-865-9 / ISSN 1048-0854) |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Thermal Behavior of Interconnect Systems: A Comparison of low-k, Airgap and SiO2 Integration (Talk). MicroNanoReliability, Berlin, 2007 Sept 2-5 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Electrical characterization of Airgap structures: Impact of film thickness and film permittivity on effective dielectric constant (Talk). European Congress on Advanced Materials and Processes EUROMAT, Nuernberg, 2007 Sept 10-13 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation. Materials for Advanced Metallization (MAM), Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84/11 (2007) pp 2587-2594 |
| Waechtler,T.; Jakob,A.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Copper thin films grown via ALD of copper oxide. European Congress on Advanced Materials and Processes - EUROMAT, Nuremberg (Germany), 2007 Sep 10-13 |
| Waechtler,T.; Oswald,S.; Pohlers,A.; Schulze,S.; Schulz,S.E.; Gessner,T.: Copper and copper oxide composite films deposited by ALD on
tantalum-based diffusion barriers (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Waechtler,T.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Composite films of copper and copper oxide deposited by ALD
. AVS 7th International Conference on Atomic Layer Deposition - ALD 2007, San Diego, California (USA), 2007 Jun 24-27 |
| Waechtler,T.; Schulz,S.E.; Oswald,S.; Gessner,T.: Atomic Layer Deposition of Copper and Copper Oxide for Applications in Microelectronic Metallization Systems. NanoScience 2007 - 5th Leibniz Conference of Advanced Science, Lichtenwalde (Germany), 2007 Oct 18-20; Micromaterials and Nanomaterials, Iss. 07/2007 (2007) pp 26-27 (ISSN 1619-2486) |
| Wieland,R.; Ecke,R.; Klumpp,A.; Merkel,R.; Schulz,S.E.; Ramm,P.: 3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology. Smart Systems Integration 2007, Paris (F), Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 649-651 (ISBN 978-3-8007-3009-4) |
