Publikationen
2024 | 2023 | 2022 | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003
Jahr 2017
Papers
| Arnold,B.; Meinecke,C.; Reuter,D.; Otto,T.; Mehner,J.: Design, Herstellung und Charakterisierung von hochpräzisen Beschleunigungssensoren, gefertigt mittels HARMS Technologie und integrierter Elektrodenabstandsverringerung . MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 582-585 (ISBN ISBN 978-3-8007-4491-6) |
| Arnold,B.; Wohlrab,D.; Meinecke,C.; Mehner,J.; Otto,T.: Design, fabrication and characterization of a high-precision MEMS tilt sensor for surgical robot navigation . European Medical and Biological Engineering Conference (EMBEC) & Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere (Finland), 2017 Jun 11-15; Proceedings, p 167ff |
| Baum,M.; Froemel,J.; Wang,W.-S.; Wiemer,M.; Otto,T.: CU-CU LOW TEMPERATURE BONDING WITH SURFACE PRE-TREATMENT METHODS. WaferBond, Leuven (Belgien), 2017 Nov 27-29; Proceedings, pp 39-40 |
| Baum,M.; Wuensch,D.; Hiller,K.; Forke,R.; Hahn,S.; Reuter,D.; Wiemer,M.; Otto,T.: Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor. Microelectronics Symposium, 2017 Pan Pacific, Kauai, HI, USA, 2017 Feb 6-9 ; Proceedings (ISBN 978-1-944543-01-3) |
| Berner,T.; Schulze,R.; Shaporin,A.; Forke,R.; Otto,T.: MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 594-597 (ISBN 978-3-8007-4491-6) |
| Geidel,S.; Otto,T.: Emerging applications: PICs as a platform for lab on chip devices. PIC Magazine |
| Goetze,U.; Symmank,C.; Schmidt,A.; Grossmann,T.D.; Schueller,M.; Kurth,S.; Otto,T.: Integrierte Geschäftsmodell- und Technologieentwicklung für smarte Systeme und Strukturen. 4SMART-Symposium, Braunschweig, 2017 Jun 21-22; In: Wiedemann, M.; Melz, T. (ed.): Smarte Strukturen und Systeme, pp 401-413 (ISBN 978-3-8440-5083-7) |
| Grossmann,T.D.; Hartwig,M.; Heinrich,M.; Decker,R.; Symmank,C.; Schmidt,A.; Kurth,S.; Goetze,U.; Baumann,R.R.; Kroll,L.; Otto,T.: Realisation of Sensitive Functionality by the Integration of Electromagentic Resonators in Composite Materials. Technologies for Lightweight Structures (TLS) |
| Grossmann,T.D.; Hartwig,M.; Heinrich,M.; Decker,R.; Symmank,C.; Schmidt,A; Kurth,S.; Baumann,R.R.; Kroll,L.; Otto,T.: Realisation of Sensitive Functionality by the Integration of Electromagnetic Resonators in Composite Materials . 3rd International MERGE Technologies Conference (IMTC), Chemnitz, 2017 Sep 21-22 (ISBN 978-3-95735-066-4) |
| Grossmann,T.D.; Hartwig,M.; Symmank,C.; Schmidt,A.; Schueller,M.; Kurth,S.; Goetze,U.; Baumann,R.R.; Otto,T.: Realisierung von smarten Strukturen mit sensorischer Funktion durch Integration elektromagnetischer Resonatoren in hybride Materialien. 4SMART-Symposium, Braunschweig, 2017 Jun 21-22; In: Wiedemann, M.; Melz, T.(ed.): Smarte Strukturen und Systeme, pp 119-129 (ISBN 978-3-8440-5083-7) |
| Helke,C.; Hiller,K.; Erben,J.; Reuter,D.; Meinig,M.; Kurth,S.; Nowak,C.; Kleinjans,H.; Otto,T.: Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: an example for Match 1:1-, eBeam-, and nanoimprint lithography. 33rd European Mask and Lithography Conference, Dresden, 2017 Jun 26-27; Proceedings, Vol. 10446 (2017) pp 1-9 |
| Helke,C.; Hiller,K.; Werner,T.; Reuter,D.; Meinig,M.; Kurth,S.; Nowak,C.; Kleinjans,H.; Otto,T.: Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers. SPIE Optics+Photonics/ Nanoengineering: Fabrication, Properties, Optics, and Devices XIV, San Diego (USA), 2017 Aug 5-10; Proceedings, Vol.10354 (2017) pp 1-11 |
| Hertel,S.; Wuensch,D.; Wiemer,M.; Otto,T.: Galvanische Abscheidung von Aluminium für die Mikrosystem- und Leiterplattentechnik. MikroSystemTechnik Kongress , Unterschleißheim, 23.-25.10.2017; Proceedings , pp 666-669 (ISBN 978-3-8007-4491-6) |
| Hofmann,C.; Kurth,F.; Wiemer,M.; Otto,T.; Hiller,K.: Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel. Smart Systems Integration Conference SSI, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 391-394 (ISBN 978-3-95735-057-2) |
| Kaupmann,P.; Pinter,S.; Franz,J.; Streiter,R.; Otto,T.: Design of a 2D MEMS Micromirror with Indirect Static Actuation. IEEE Sensors 2017 Conference, Glasgow (UK), 2017 Oct 29-Nov 1; Proceedings (ISBN 978-1-5090-1012-7) |
| Kaupmann,P.; Pinter,S.; Franz,J.; Streiter,R.; Otto,T.: A Novel Gyroscopic Actuation Concept for 2D MEMS Micromirrors. Eurosensors Conference 2017, Paris (France), 2017 Sep 3-6; Proceedings, 1, 4 (2017) p 546 |
| Langenickel,J.; Meyer,M.; Weiss,A.; Otto,T.: Integration of LEDs based on Quantum Dots within Lightweight Structures. IMTC, Chemnitz, 2017 Sep 21; Proceedings |
| Langenickel,J.; Weiss,A.; Otto,T.: Influence of processing atmosphere for QD-LEDs. Smart Systems Integration, Cork, 2017 Mar 08; Proceedings |
| Louriki,L.; Staffeld,P.; Kaelberer,T.; Otto,T.: Multilayer Micromechanics Process with Thick Functional Layers (EPyC40). Eurosensors Conference 2017, Paris (France), 2017 Sept 3-6; Proceedings, 1, 4 (2017) p 296 |
| Louriki,L.; Staffeld,P.; Kaelberer,T.; Otto,T.: Silicon Sacrificial Layer Technology for the Production of 3D MEMS (EPyC Process). Eurosensors Conference 2017, Paris (France), 2017 Sept 3-6; Proceedings, 1, 4 (2017) p 295 |
| Luo,J.; Cerretti,G.; Krause,B.; Zhang,L.; Otto,T.; Jenschke,W.; Ullrich,M.; Tremel,W.; Voit,B.; Poetschke,P.: Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: switching from p-type to n-type by the addition of polyethylene glycol. Journal Polymer 108 (2017), pp 513-520 |
| Martin,J.; Shetty,K.; Reimann,N.; Neukirchner,S.; Fuegmann,U.; Illing-Guenther,H.; Nestler,D.; Huebler,A.C.; Nendel,K.; Kroll,L.; Otto,T.: Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics. 3rd International MERGE Technologies Conference , Chemnitz (Germany), 2017 Sept 21-22; Proceedings, p 121 (ISBN 978-3-95735-066-4) |
| Martin,J.; Shetty,K.; Reimann,N.; Neukirchner,S.; Fuegmann,U.; Illing-Guenther,H.; Nestler,D.; Huebler,A.C.; Nendel,K.; Kroll,L.; Otto,T.: Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics. Technologies for Lightweight Structures, Special Issue: 3rd International MERGE Technologies Conference (IMTC), 1, 2 (2017) pp 128-137 (ISSN 2512-4587) |
| Moebius,M.; Martin,J.; Hartwig,M.; Baumann,R.R.; Otto,T.: Detection of mechanical loads in lightweight structures using quantum dots photoluminescence. Smart Systems Integration, Cork (Ireland), 2017 Mar 08; Proccedings, pp 423-426 (ISBN 978-3-95735-057-2) |
| Moebius,M.; Martin,J.; Otto,T.: Development and integration of film-based sensors for load detection in lightweight structures. International MERGE Technologies Conference, Chemnitz, 2017 Sep 21-22; 3rd International MERGE Technologies Conference (IMTC), pp 145-146 (ISBN 978-3-95735-066-4) |
| Pleul,M.; Meinecke,C.; Streit,P.; Albers,J.; Kuerschner,R.; Schubert,E.; Reuter,D.; Otto,T.: Robuster Vibrationssensor zur Zustandsüberwachung an Schienenfahrzeugen. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 840-843 (ISBN ISBN 978-3-8007-4491-6) |
| Rost,F.; Arnold,B.; Decker,R.; Mehner,J.; Kroll,L.; Rzepka,S.; Otto,T.: Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 858-861 (ISBN ISBN 978-3-8007-4491-6) |
| Schroeder,T.; Baum,M.; Wuensch,D.; Wiemer,M.; Otto,T.: 3D packaging for an implantable hemodynamic control system. BMTMedPhys 2017, Dresden (Germany), 2017 Sept 11-13; Biomedical Engineering / Biomedizinische Technik, 62, S1 (2017) p S356 (ISBN ISSN (Online) 1862-278X, ISSN (Print) 0013-5585) |
| Schroeder,T.; Wuensch,D.; Baum,M.; Hiller,K.; Wiemer,M.; Otto,T.; Weidenmueller,J.; Oezgue,D.; Utz,A.; Goertz,M.: 3D Packaging Technologies for Smart Medical Implants. Smart Systems Integration Conference, Cork, Ireland, 2017 Mar 8-9; Proceedings, pp 41-47 (ISBN 978-3-95735-057-2) |
| Selbmann,F.; Baum,M.; Hecker,C.; Roscher,F.; Enderlein,T.; Wiemer,M.; Joseph,Y.; Otto,T.: Investigations on Parylene C for its Integrability into MEMS. Smart Systems Integration SSI, Cork, Irland, 2017 Mar 8-9; Proceedings |
| Selbmann,F.; Hofmann,L.; Baum,M.; Roscher,F.; Wiemer,M.; Schulz,S.E.; Joseph,Y.; Otto,T.: Parylene as a dielectric material for MEMS applications. Materials for Advanced Metallization (MAM), Dresden, Mar. 26-29; Proceedings |
| Selbmann,F.; Saeidi,N.; Mohandas,P.M.; Baum,M.; Wiemer,M.; Jerke,M.; Joseph,Y.; Otto,T.: Thin film encapsulations for medical applications. Mikrosystemtechnikkongress, München, 2017 Oct 23-25; Proceedings |
| Stiehl,C.; Enderlein,T.; Otto,T.; Nestler,J.: Novel concept of integrated micro actuation of membranes in liquid environments. Smart Systems Integration, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 487-490 (ISBN 978-3-95735-057-2) |
| Streit,P.; Nestler,J.; Schulze,R.; Shaporin,A.; Otto,T.: Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system. 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, 2017 Apr 2-5; Proceedings |
| Wecker,J.; Kurth,S.; Meinig,M.; Otto,T.; Bauch,A.; Weigel,R.; Kissinger,D.; Hackner,A; Prechtel,U.: Millimeterwellen-Sensorsystem zur Messung der Sauerstoffkonzentration in Gasen. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 120-123 (ISBN 978-3-8007-4491-6) |
| Willert,A.; Zichner,R.; Thalheim,R.; Baumann,R.R.; Otto,T.: Go Beyond 4.0 – Towards Digital Fabrication Based on Printing. IMTC 2017 Lightweight Structures, 3rd International MERGE Technologies Conference, Chemnitz (Germany), 2017 Sept 21-22; KB Poster and other (ISBN 978-3-95735-066-4) |
| Wuensch,D.; Martinka,R.; Schubert,I.; Baum,M.; Wiemer,M.; Otto,T.: Temporary wafer bonding - key technology for MEMS devices. Microelectronics Symposium, 2017 Pan Pacific, Kauai, HI, USA, 2017 Feb 6-9; Proceedings (ISBN 978-1-944543-01-3) |
| Wuensch,D.; Wiemer,M.; Otto,T.: TEMPORARY WAFER BONDING USING ROOM TEMPERATURE MECHANICAL RELEASE FOR MEMS DEVICES. WaferBond, Leuven, 2017 Nov 27-29; Proceedings, pp 57-58 |
