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Honorarprofessur Opto Electronic Systems
Publikationen

Publikationen

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Jahr 2018

Books

Otto,T.: Chapter Leitprojekt “Go Beyond 4.0”: Individualisierte Massenfertigung. in the book: Digitalisierung: Schlüsseltechnologien für Wirtschaft & Gesellschaft, 1st edition, ed. by Reimund Neugebauer (2018) pp 223-238 (ISBN 978-3-662-55889-8)

Papers

Al Farisi,M.S.; Hertel,S.; Wiemer,M.; Otto,T.: Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Toward Microsystems Application. Micromachines 2018, art. 589, 9, 11 (2018) (ISSN 2072-666X)
Al Farisi,M.S.; Hertel,S.; Wiemer,M.; Otto,T.: Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl Ionic Liquid for microsystems application. International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Kuwana (Japan), 2018 Apr 17-21; Proceedings, Conference Proceedings, IEEE xplore, pp 415-418
Baum,M.; Saeidi,N.; Vogel,K.; Schroeder,T.; Selvam,K.G.M.; Wiemer,M.; Otto,T.: An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization . International Ultrasonic Symposium, Kobe (Japan), 2018 Oct 22-25; Proceedings, 18326814 (2018) (ISBN 1948-5727, 1948-5719, 978-1-5386-3425-7, 978-1-5386-3426-4)
C.Zeiner; M.Polomoshnov; M.Mueller; E.Sowade; A.Guenther; N.Neumann; Seifert,T.; Blaudeck,T.; Hermann,S.; Baumann,R.R.; Wiemer,M.; Otto,T.: Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors . Smart Systems Integration (SSI), Dresden, 2018 Apr 11-12 pp 39-45 (ISBN 978-3-95735-082-4)
Dittmar,N.; Kuechler,M.; Meinecke,C.; Reuter,D.; Otto,T.: Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff. . 14. Fachtagung Mikrosystemtechnik, Chemnitz, 2018 Oct 23-24; Proceedings, pp 125-130 (ISBN 978-3-00-060648-9)
Geneiss,V.; Lueke,T.; Hedayat,C.; Wolf,M.; Janek,F.; Meissner,T.; Barth,M.; Eberhardt,W.; Zimmermann,S.; Otto,T.: Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed- Signal Systems with MID Technology. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden (Germany), Apr 11-12; Proceedings, pp 488-491 (ISBN 978-3-95735-082-4)
Grossmann,T.D.; Kurth,S.; Otto,T.: Metamaterial based Sensor Approach for Passive Structural Health Monitoring of Lightweight Structures. 14. Chemnitzer Fachtagung Mikrosystemtech, Chemnitz, 2018 Oct 23-24
Hafez,M.; Haas,S.; Loebel,K.-U.; Reuter,D.; Ramsbeck,M.; Schramm,M.; Horstmann,J.-T.; Otto,T.: Characterisation of MOS Transistors as an Electromechanical Transducer for Stress. Phys. Status Solidi A , 2018 (2018) pp 680-693
Hangmann,C.; Hedayat,C.; Hilleringmann,U.; Otto,T.: Stochastic Analyzes and Monte-Carlo Simulations of nonlinear and non-ideal Mixed-Signal Phase-Locked Loops. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 492-495 (ISBN 978-3-95735-082-4)
Hedayat,C.; Hilleringman,U.; Lange,S.; Schroeder,D.; Otto,T.: Induktive Ortungsverfahren zur Lokalisierung von Kleinstfunksensoren in kleinen Messvolumina. 23th Leibniz-Conference 2018 – Lokaliserungstechniken für IoT, Telematik und Industrie 4.0, Lichtenwalde (Germany), 2018 Nov 22-23; Proceedings, Abstracts der Konferenzbeiträge
Heinrich,K.; Martin,J.; Langenickel,J.; Selbmann,F.; Otto,T.: Integration of quantum dot sensitized solar cells onto technical textiles. European Advanced Materials Congress, Stockholm (Sweden), 2018 Aug 20-23; proceedings, p 118 (ISBN ISBN 978-91-88252-12-8)
Heinrich,K.; Martin,J.; Mehlhorn,H.; Langenickel,J.; Selbmann,F.; Hartwig,M.; Otto,T.: Challenges in transferring quantum dot sensitized solar cells on technical textiles. Smart Systems Integration Conference 2018 (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 416-419 (ISBN 978-3-95735-082-4)
Hertel,S.; Schulte,W.; Weiser,M.; Becker,M.; Wiemer,M.; Otto,T.: Electrochemical deposition of reactive material systems for assembly and packaging applications. Mikro-Nano-Integration 2018, Dortmund, 2018 Oct 22-23; Proceedings, 92 (2018) pp 38-43 (ISBN ISBN 978-3-8007-4789-4)
Hertel,S.; Wiemer,M.; Otto,T.: Galvanische Aluminium-Abscheidung auf unerschiedlichen Startschichten für die Leiterplatten- und Mikrosystemtechnik. Jahrbuch der Oberflächentechnik, 74 (2018) pp 50-64 (ISBN ISBN 978-3-87480-349-6)
Hertel,S.; Wuensch,D.; Wiemer,M.; Otto,T.; Friedrich,S.: Elektrochemische Abscheidung für die Leiterplatte. Elektronische Baugruppen und Leiterplatten 2018, Fellbach, 2018 Feb 20.-21.; Proceedings, 340 (2018) pp 203-209 (ISBN ISBN 978-3-96144-026-9)
Martin,J.; Saupe,R.; Langenickel,J.; Moebius,M.; Heinrich,K.; Weiss,A.; Otto,T.: Nanostructures for smart systems. Semiconductor Technology International Conference (CSTIC) , Shanghai, China, 2018 Mar 11-12; IEEE Xplore, pp 1-4 (ISBN 978-1-5386-5308-1 )
Moebius,M.; Martin,J.; Hartwig,M.; Baumann,R.R.; Otto,T.: Visualization of mechanical loads with semiconductor nanocrystals. European Advanced Materials Congress, Stockholm (Sweden), 2018 Aug 20-23; Proceedings (ISBN 978-91-88252-12-8)
Otto,T.: Trends and Tendencies, New Examples,. Smart Systems Integration (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, Microsystems Technology in Germany 2018, pp 16-17 (ISSN 2191-7183)
Otto,T.; Kurth,S.; Voigt,S.; Morschhauser,A.; Meinig,M.; Hiller,K.; Moebius,M.; Vogel,M.: Integrated Microsystems for Smart Applications. Sens. Mater., 30, 4 (2018) pp 767-778
Schmidt,M.; Metz,G.; Hedayat,C.; Otto,T.; Petrov,D.: RFID Units for a Product Based Control of Industrial Production Systems. Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems (SSI 2018), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 484-487 (ISBN 978-3-95735-082-4)
Schueller,M.; Lipowski,M.; Weigel,P.; Symmank,C.; Meynerts,L.; Walther,M.; Dziuba,F.; Otto,T.; Goetze,U.; Kroll,L.: Active flow control in wind turbines - integration technologies and assessment of economic effects. Smart Systems Integration Conference 2018 (SSI), Proceedings, pp. 500-503 , Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 500-503 (ISBN 978-3-95735-082-4)
Selbmann,F.; Baum,M.; Wiemer,M.; Joseph,Y.; Otto,T.: Parylene as a dielectric material for electronic applications in space. 2018 IEEE, 68th Electronic Components and Technology Conference (ECTC 2018), San Diego, CA, USA, 2018 May 29-Jun 1; Proceedings, 17991851 (2018) pp 2205-2210 (ISBN 2377-5726, 978-1-5386-4999-2, 978-1-5386-5000-4)
Stoeckel,C.; Meinel,K.; Melzer,M.; Otto,T.: THIN FILM PIEZOELECTRIC ALUMINUM NITRIDE FOR PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCERS. IEEE Sensors 2018, Neu Dehli, Indien, October 28 - 31
Streit,P.; Nestler,J.; Shaporin,A.; Graunitz,J.; Otto,T.: Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems. Journal of Micromechanics and Microengineering, 28, 6 (2018) (ISSN 09601317)
Vogel,K.; Roscher,F.; Wiemer,M.; Zimmermann,S.; Otto,T.: Reactive bonding with oxide based reactive multilayers. Smart Systems Integration Conference 2018 (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 71-78 (ISBN 978-3-95735-082-4)
Wolf,M.; Janek,F.; Meissner,T.; Wigger,B.; Barth,M.; Guenter,T.; Eberhardt,W.; Zimmermann,A.; Geneiss,V.; Lueke,T.; Hedayat,C.; Otto,T.: Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing. 13th International Congress Molded Interconnect Devices (MID), 6 pages, Würzburg (Germany), 2018 Sep 25-26; Proceedings, IEEE Xplore Digital Library, 18232735 (2018) (ISBN 978-1-5386-4933-6, 978-1-5386-4932-9, 978-1-5386-4934-3)
Zimmermann,S.; Haase,M.; Lang,N.; Roepke,J.; Schulz,S.E.; Otto,T.: The role of plasma analytics in leading-edge semiconductor technologies. Volume 58, Issue 5 18th Topical Conference for Plasma Technology , Göttingen (Germany), 2017 Feb 20–22; Contributions to Plasma Physics 2018, 58, 5 (2018) pp 367-376 (ISSN 1521-3986)