| Baum,M.; Hientzsch,M.; Boese-Landgraf,J.; Otto,T.; Gessner,T.: Verschleißmonitoring bei Hüftgelenkendoprothesen durch integrierte Mikrosensorik. Mikrosystemtechnik Kongress 2005, 2005 Oct 10-12; Proceedings, pp 633-636 (ISBN 3-8007-2926-1) |
| Baum,M.; Nestler,J.; Rost,D.; Weissmantel,S.; Otto,T.; Reisse,G.; Gessner,T.: Improved Silicon Master Tools for Hot Embossing. Micro System Technologies 2005, Munich (Germany), 2005 Oct 5-6; Proceedings, pp 76-82 (ISBN 3-7723-7040-3) |
| Gessner,T.; Schulz,S.E.; Hiller,K.; Otto,T.; Radehaus,C.; Doetzel,W.; Mueller,D.; Loebner,B.; Wanielik,G.; Neubert,U.; Lutz,J.: Profillinie 3: Mikroelektronik und Mikrosystemtechnik. FORSCHUNG MIT PROFIL, pp 1-162 (ISSN 0946-1817) |
| Jia,Chenping; Nestler,J.; Otto,T.; Gessner,T.: FEM simulation and its application in MEMS design. 17. International Wissenschaftliche Konferenz Mittweida, Mittweida (Germany), Nov. 3-4; Proceedings (ISSN 1437-7624) |
| Jia,Chenping; Wiemer,M.; Mueller,R.; Otto,T.; Gessner,T.: Fabrication of embedded micro-channels by intended under-etching and trench filling. Micro System Technologies 2005, Munich (Germany), Oct. 5-6; Proceedings, pp 71-75 (ISBN 3-7723-7040-3) |
| Jia,Chenping; Wiemer,M.; Zichner,N.; Otto,T.; Gessner,T.: Fabrication and characterisation of a bulk micro-machined ultrasonic transducer. 2005 IEEE Ultrasonic Symposium, Rotterdam (Netherlands), Sep. 19-21; Proceedings |
| Nestler,J.; Baum,M.; Otto,T.; Gessner,T.: Micro Systems Applications in Biotechnology and Health Care. Annual Report 2004; Annual Report 2004 Center for Microtechnologies (ZfM), Editors: T. Gessner, W. Seckel (2005), 2004 (2005) pp 94-95 |
| Otto,T.; Saupe,R.; Stock,V.; Bruch,R.; Gruska,B.; Gessner,T.: A novel dual-detector micro spectrometer. SPIE Photonics West: MOEMS and Miniaturized Systems V, San Jose; Proceedings of SPIE , 5719 (2005) pp 76-82 |
| Wiemer,M.; Froemel,J.; Gessner,T.; Otto,T.: Chapter Wafer bonding in micro mechanics and microelectronics - an overview. Anniversary edition 60th birthday of Herbert Reichl, 2005 Goldbogen Verlag, Dresden (Germany) ; B. Michel, R. Aschenbrenner (Hrsg.), The World of Electronic Packaging and System Integration – Anniversary edition 60th birthday of Herbert Reichl, 2005 Goldbogen Verlag, Dresden (Germany) , pp 307-313 (ISBN 3-932434-76-5) |
