Technical Equipment
Material Compounds
Thermal joining device
Device: Thermal joining device (in-house development)
Specifications:
- Production of samples in the lap joint (25 mm x 12.5 mm)
- Heating of the sample’s bottom side (max. 500 °C)
- Sample width (10 mm - 40 mm)
- Pressing the joining partners (max. Pressing force 480 N)

Thermal joining system for lap joints
Contact Person

Dr.-Ing. Maik Trautmann
- Telefon:+49 371 531-38846
- Fax:+49 371 531-838846
- Raum:3, 3/A104
- E-Mail: