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Group of Composites and Material Compounds
Professur Verbundwerkstoffe und Werkstoffverbunde
Group of Composites and Material Compounds 

Technical Equipment

Material Compounds

Thermal joining device

Device: Thermal joining device (in-house development)

Specifications:

  • Production of samples in the lap joint (25 mm x 12.5 mm)
  • Heating of the sample’s bottom side (max. 500 °C)
  • Sample width (10 mm - 40 mm)
  • Pressing the joining partners (max. Pressing force 480 N)
Thermische Fügeanlage für Überlappverbindungen

Thermal joining system for lap joints

Contact Person

Foto des Ansprechpartners Maik Trautmann
Dr.-Ing. Maik Trautmann
  • Telefon:
    +49 371 531-38846
  • Fax:
    +49 371 531-838846
  • Raum:
    3, E01.104 (alt: 3/A104)
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