Jump to main content
Group of Composites and Material Compounds
Professur Verbundwerkstoffe und Werkstoffverbunde

Technical Equipment

Material Compounds

Thermal joining device

Device: Thermal joining device (in-house development)

Specifications:

  • Production of samples in the lap joint (25 mm x 12.5 mm)
  • Heating of the sample’s bottom side (max. 500 °C)
  • Sample width (10 mm - 40 mm)
  • Pressing the joining partners (max. Pressing force 480 N)
Thermische Fügeanlage für Überlappverbindungen

Thermal joining system for lap joints

Contact Person

Foto des Ansprechpartners Maik Trautmann
Dr.-Ing. Maik Trautmann