| Behl,C.; Behlert,R.; Seiler,J.; Helke,C.; Shaporin,A.; Hiller,K.: Characterization of Thin AlN/Ag/AlN-Reflector Stacks on Glass Substrates for MEMS Applications. Micro, 4, 1 (2024) pp 142-156 |
| Bickmann,C.; Meinecke,C.; Korten,T.; Sekulla,H.; Helke,C.; Blaudeck,T.; Reuter,D.; Schulz,S.E.: Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces. Micro and Nano Engineering, 23, 100265 (2024) pp 1-5 |
| Bickmann,C.; Viriato,L.; Schwotzer-Uhlig,P.; Buschbeck,R.; Schade,A.; Meinecke,C.; Vogel,K.; Reuter,D.; von Unwerth,T.; Kuhn,H.: Evaluation of Thin Pd Layers for a Sensor System Monitoring Anode-Side Hydrogen Concentration in a Fuel Cell. Smart Systems Integration Conference and Exhibition (SSI), Hamburg, Germany; Proceedings, pp 1-4 |
| Blangiardi,F.; Beltrán,B.R.; Zhao,Z.; Streiter,R.; Roessler,M; Langer,J.; Heinkel,U.; Kuhn,H.: Exploring Data Fusion for AI-Based People Counting in a Static Public Transport Vehicle Using Multiple IR-UWB Transceivers. 2024 Sensor Data Fusion: Trends, Solutions, Applications (SDF), Bonn (Germany), 2024 Nov 25-27; Proceedings (ISBN 979-8-3315-2744-0, 979-8-3315-2745-7) |
| Bonitz,J.; Helke,C.; Dittmar,N.; Schermer,S.; Haase,M.; Hofmann,L.; Reuter,D.: Scalable fabrication approach for single pixel microlens arrays. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Bonitz,J.; Helke,C.; Dittmar,N.; Schermer,S.; Haase,M.; Hofmann,L.; Reuter,D.: Scalable fabrication approach and fill factor optimization for single pixel microlens arrays. Journal of Vacuum Science & Technology B, 42, 6 (2024) |
| Diex,K.; Jaeckel,T.; Wuensch,D.; Vogel,K.; Bonitz,J.; Hanisch,A.; Wiemer,M.; Schulz,S.E.: Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration. 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg (Germany), 2024 Apr 16-18; Proceedings (ISBN 979-8-3503-8877-0, 979-8-3503-8878-7) |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Fischer,T.; Helke,C.; Haase,M.; Hanisch,A.; Hofmann,L.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding. 10th Electronics System-Integration Technology Conference (ESTC), Berlin (Germany), 2024 Sep 11-13; Proceedings, pp 1-5 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis. ECS Journal of Solid State Science and Technology, 13, 10 (2024) |
| Forke,R.; Tsukamoto,T.; Shaporin,A.; Weidlich,S.; Buelz,D.; Hahn,S.; Tanaka,S.; Hiller,K.: Advancement in the MEMS Gyroscope from a Vibrating Tuning Fork to a Tuned Ring with Comb Electrodes. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
| Gottwald,M.; Hartmann,S.; Helke,C.; Sendel,M.; Biller,H.; Schirmer,M.; Reuter,D.: Progress on an Intra-Level Mix & Match approach of the chemically amplified positive-tone photoresist SX AR-P 7200.14 for EBL and i-line stepper lithography. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Haase,M.; Sayyed,M.; Langer,J.; Reuter,D.; Kuhn,H.: About the Data Analysis of Optical Emission Spectra of Reactive Ion Etching Processes - The Method of Spectral Redundancy Reduction. Plasma, 7 (2024) pp 258-283 |
| Hartmann,S.; Gottwald,M.; Helke,C.; Dittmar,N.; Haase,M.; Linn,E.; Haedrich,M.; Reuter,D.: 2.5D Patterning of photonic structures by electron beam-based grayscale lithography processes. 50th International Micro and Nano Engineering Conference, Montpellier (France), 2024 Sep 16-19; Proceedings, pp 1-2 |
| Hauck,M.; Bickmann,C.; Morgenstern,A.; Nagel,N.; Meinecke,C.; Schade,A.; Tafat,R.; Viriato,L.; Kuhn,H.; Salvan,G.; Schondelmaier,D.; Ullrich,T.; von Unwerth,T.; Streif,S.: Perspective on the Development and Integration of Hydrogen Sensors for Fuel Cell Control. Energies , 17, 20 (2024) pp 1-18 |
| Helke,C.; Schermer,S.; Hartmann,S.; Bonitz,J.; Haase,M.; Linn,E.; Haedrich,M.; Zanzal,A.; Reynolds,P.; DeMoor,S.; Voigt,A.; Reuter,D.: 2.5D-Patterning of photonic structures by electron beam and i-line stepper based grayscale lithography processes. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Helke,C.; Schermer,S.; Hartmann,S.; Voigt,A.; Reuter,D.: Intra-Level Mix & Match investigations of negative tone photoresists mr-EBL 6000.5 and ma-N 1402 for i-line stepper and electron beam lithography. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Helke,C.; Seiler,J.; Meinig,M.; Grossmann,T.D.; Bonitz,J.; Haase,M.; Zimmermann,S.; Ebermann,M.; Kurth,S.; Reuter,D.; Hiller,K.: Integration of (Poly-Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer-Level MOEMS Fabrication Process.. EEJ Transactions on Electrical and Electronic Engineering 2024, 19, 5 (2024) pp 767-772 |
| Huber,M.; Hu,X.; Zienert,A.; Schuster,J.; Schulz,S.E.: Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing. The Journal of Chemical Physics, 157, 8 (2024) (ISBN 0021-9606, 1089-7690) |
| May,D.; Wunderle,B.; Cirulis,I.; Braun,S.; Zschenderlein,U.; Heilmann,J.; Pantou,R.; Schacht,R.; Rzepka,S.; Abo Ras,M.; Kurth,S.; Kuhn,H.: Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania (Italy), 2024 Apr 7-10; Proceedings (ISBN 979-8-3503-9363-7, 979-8-3503-9364-4, 2833-8596, 2833-8553) |
| Monakhov,K.Y.; Meinecke,C.; Moors,M.; Schmitz-Antoniak,C.; Blaudeck,T.; Hann,J.; Bickmann,C.; Reuter,D.; Otto,T.; Schulz,S.E.; Parala,H.; Devi,A.: Molecular approach to semiconductors: a shift towards ecofriendly manufacturing and neuroinspired interfaces. Pure and Applied Chemistry, 96, 9 (2024) pp 1313-1331 |
| Qu,J.; Hu,X.; Deconinck,M.; Liu,L.; Cheng,Y.; Zhao,R.; Wang,M.; Zhang,H.; Vaynzof,Y.; Schuster,J.; Cabot,A.; Leistner,K.; Li,F.: Trisodium Citrate-Assisted Synthesis of Edge-Abundant Nickel-Iron Layered Double Hydroxides for Efficient Oxygen Evolution Reaction. ChemCatChem, Early View, e202401667 (2024) |
| Roehlig,D.; Kuhn,E.; Teichert,F.; Traehnhardt,A.; Blaudeck,T.: Function phononic crystals. Europhysics Letters, 145, 2 (2024) p 26001 (ISBN 0295-5075, 1286-4854) |
| Sayyed,M.A.; Rothe,T.; Langer,J.; Haase,M.; Kuhn,H.: Real-Time End Point Detection via Automated Dynamic Mode Decomposition. 2024 IEEE International Conference on Plasma Science (ICOPS), Beijing (China), 2024 Jun 16-20; Proceedings (ISBN 979-8-3503-6091-2, 979-8-3503-6092-9, 2576-7208, 0730-9244) |
| Schermer,S.; Hartmann,S.; Gottwald,M.; Bieling,J.; Helke,C.; Haase,M.; Linn,E.; Haedrich,M.; Zanzal,A.; Rexnolds,P.; DeMoor,S.; Voigt,A.; Reuter,D.: Patterning of 2.5D grayscale structures by electron beam and i-line stepper lithography processes. 50th International Micro and Nano Engineering Conference, Montpellier (France), 2024 Sep 16-19; Proceedings, pp 1-2 |
| Schermer,S.; Helke,C.; Reinhardt,M.; Hartmann,S.; Tank,F.; Wecker,J.; Heldt,G.; Voigt,A.; Reuter,D.: Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach. Micro and Nano Engineering, 23, 100264 (2024) pp 1-6 |
| Schermer,S.; Helke,C.; Sake,B.; Zanzal,A.; Reynolds,P.; DeMoor,S.; Voigt,A.; Reuter,D.: 2.5D-patterning via i-line grayscale exposure for photonic structures and micro lens arrays. Novel Patterning Technologies 2024, 2024 Apr 9; Proc. SPIE, 12956 (2024) p 1 |
| Schermer,S.; Zanzal,A.; Reynolds,P.; DeMoor,S.; Helke,C.; Bieling,J.; Voigt,A.; Reuter,D.: i-line grayscale exposure using ma-P 1200G resist series for industry applications. 50th International Micro and Nano Engineering Conference, Montpellier (France), 2024 Sep 16-19; Proceedings, pp 1-2 |
| Seifert,Tom; Kuechler,M.; Haase,M.; Reuter,D.: Model based comparison of SF6 based bulk silicon etch process between different ICP plasma Chambers. PESM&PlaCEP, Leuven (Belgium), 2024 Jun 10-12; Proceedings |
| Stoeckel,C.; Meinel,K.; Melzer,M.: Verfahren zur Herstellung eines mikromechanischen Ultraschallwandlers und zugehöriger
Ultraschallwandler. DE 10 2023 111 777 A1 |
| Stoeckel,C.; Mulay,S.; Meinel,K.; Bankwitz,J.; Seiler,J.; Ullmann,D.; Reuter,D.: Technology for Piezoelectric Micromachined Ultrasonic Transducers with Adaptive Channel Geometry and Chip Size. IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), Taipeh pp 1-4 |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: Mode Localization and Frequency Modulation Sensing Using Superposed in-Phase and Anti-Phase Oscillations. IEEE MEMS, Austin, TX (USA), 2024 Jan 21-25; Proceedings (ISBN 979-8-3503-5792-9) |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: High Sensitivity Mode-Localized Ring Resonator With Tunable Sensitivity. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
| Wunderle,B.; Stevens,M; May,D.; Dannenberg,E.; Hermann,S.; Grosse-Kockert,C.; Abo Ras,M.; Hermannsdorfer,A.; Koehne,M.: Thermal Characterisation and Technology of Intercalated Graphene-Based Nano-Laminates. 2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Toulouse (France), 2024 Sep 25-27; Proceedings (ISBN 979-8-3503-8782-7, 979-8-3503-8783-4, 2474-1523, 2474-1515) |
