Publikationen
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Jahr 2004
Papers
| Baum,M.: Optical devices and biomedical application. A*Star IZM Workshop, Singapore, 2004 Nov 8 |
| Belsky,P.; Streiter,R.; Wolf,H.; Gessner,T.: Application of Molecular Dynamics to the Simulation of IPVD. AMC, San Diego (USA), 2004 Oct 19-21 |
| Blaschta,F.; Schulze,K.; Schulz,S.; Gessner,T.: SiO2 aerogel ultra low k dielectric patterning using different hard mask concepts and stripping processes. Microelectronic Eng., 76 (2004) pp 8-15 |
| Bonitz,J.; Schulz,S.E.; Gessner,T.: Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials. Microelectronic Engineering, 76 (2004) pp 82-88 |
| Ecke,R.; Schulz,S.E.; Hecker,M.; Engelmann,H.-J.; Gessner,T.: W(Si)N Diffusion Barriers for Cu Metallization deposited by PECVD. Advanced Metallization Conference AMC 2004, San Diego, USA, 2004 Oct 19-21 |
| Froemel,J.; Billep,D.; Wiemer,M.: Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems. Workshop on Wafer Bonding for MEMS Technologies, Halle, 11,12 Oktober 2004 |
| Fruehauf,S.; Schulz,S.E.; Gessner,T.: Integrationspotential mesoporöser SiO2-Schichten als ultra-low-k Dielektrikum. Vakuum in Forschung und Praxis, 16 (2004) pp 194-198 (ISSN 0947-076X) |
| Geiger,W.; Breng,U.; Deppe-Reibold,O.; Fuchs,W.; Gutmann,W.; Hafen,M.; Handrich,E.; Huber,M.; Kunz,J.; Leinfelder,P.; Newzella,A.; Ohmberger,R.; Ruf,M.; Schroeder,W.; Spahlinger,G.; Rasch,A.; Hiller,K.; Billep,D.: Test Results of the Micromechanical Coriolis Rate Sensor µCORS II. DGON 2004 Symposium Gyro Technology, Stuttgart |
| Gessner,T.: Microelectronics and MEMS: Overview about FhG-IZM and the Fraunhofer Organization. Fraunhofer (IZM) - SERC a-star MEMS Workshop, IME Singapore, 2004 Nov 8 |
| Gessner,T.: Advanced Silicon Micromachining Technologies. MEMS Workshop, Industrial Technology Research Institute ITRI, Taiwan, 2004 Mar 1 |
| Gessner,T.: MEMS Metallization. Invited Talk, MRS Spring Meeting 2004, San Francisco (USA), 2004 Apr 12-16 |
| Gessner,T.: Microsystems Technologies. Leipziger Messe Z 2004, Leipzig |
| Gessner,T.: Copper Metallization systems and low k dielectrics. Joint Workshop on Materials for Advanced Interconnects, Fudan University Shanghai (China), 2004 Jul 13-14 |
| Gessner,T.: Mikroelektronik- und Mikrosystemtechnik-Forschung am Zentrum für Mikrotechnologien der Technischen Universitaet Chemnitz in Kooperation mit dem Fraunhofer IZM. Kolloquium am ZMN Ilmenau, Ilmenau (Germany), 2004 Jul 30 |
| Gessner,T.: Microelectronics and MEMS: Challenges for the Technology Transfer into the Industry within the Fraunhofer Organization. MINAPIM, Manaus, Amazonas (Brazil), 2004 Sep 15-18 |
| Gessner,T.: Technology Approaches for Inertial Sensors. Invited Talk, ISINTIT 2004, Nanjing (China), 2004 Oct 15-16 |
| Gessner,T.: Mikrosysteme im Automobil. Chemnitzer Automobiltagung, TU Chemnitz, Chemnitz (Germany), 21 Oct 2004 |
| Gessner,T.: The Scientific System in Germany – Universities, Max-Planck-Institutes, Fraunhofer Organization, Leibniz-Foundation and Helmholtz-Foundation. Workshop at Chongqing University, Chongqing (China), 2004 Oct 12 |
| Gessner,T.: Systems Integration – A Challenge for Micro- and Nanotechnologies. Kolloquium caesarianum, Stiftung caesar, Bonn (Germany), 2004 Oct 26 |
| Gessner,T.: Challenges and trends for advanced interconnect systems – contribution and experiences of TU Chemnitz / ZfM and FhG-IZM Chemnitz. AMD-Silicon Saxony, Dresden (Germany), 2004 Nov 3 |
| Gessner,T.; Bertz,A.; Lohmann,C.; Wiemer,M.; Kurth,S.; Hiller,K.: Advanced Silicon Micromachining. Suss MEMS Seminar, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Shanghai (China), 2004 Nov 12 |
| Gessner,T.; Hiller,K.; Bertz,A.: MEMS for automotive applications. Nanofair 2004, 2004; VDI-Berichte 1839, pp 77-82 |
| Gessner,T.; Hiller,K.; Huebler,A.; Kurth,S.: Micro Scanners for Spectrum Analysis Systems. Invited Talk, Actuator 2004, Bremen (Germany), 14 Jun 2004 |
| Gessner,T.; Schulz,S.E.: Selected Challenges for Advanced Interconnect Systems. Invited Talk, E-MRS 2004, Strasbourg (France), 2004 May 24-28 |
| Hanf,M.; Kurth,S.; Billep,D.; Hahn,R.; Faust,W.; Heinz,S.; Doetzel,W.; Gessner,T.: A Dynamically Driven Micro Mirror Array as Light Modulator in a Hadamard Transform Spectrometer (HTS). Eurosensors XVIII, Roma (Italy), 2004 Sep |
| Himcinschi,C.; Friedrich,M.; Fruehauf,S.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.: Contributions to the static dielectric constant of low-k xerogel films derived from ellipsometry and IR spectroscopy. Thin Solid Films, 455-456 (2004) pp 433-437 |
| Koerner,H.; Bueyuektas,K.; Eisener,B.; Liebmann,R.; Schulz,S.E.; Seidel,U.; Gessner,T.: Impact of Ultra Low k dielectrics on RF-Performance of Inductors. Advanced Metallization Conference AMC 2004, San Diego, USA, 2004 Oct 19-21 |
| Leidich,S.; Voigt,S; Kurth,S; Rawat,B.; Gessner,T.: Microwave Phase Shifter in Bulk Micro Mechanic Technology. International Conference of Applied Electronics, Plzen (Czech Republic), 2004 |
| Lohmann,C.; Gottfried,K.; Bertz,A.; Reuter,D.; Hiller,K.; Kuhn,M.; Gessner,T.: MEMS Metallization. Materials, Technology and Reliabilitity for Advanced Interconnects and Low-k Dielectrics – 2004 (Eds. R.J Carter, C.S. Hau-Riege, G.M. Kloster, T.-M. Lu, S.E. Schulz), MRS Symp. Proc. 812 (2004) pp 233-242 (ISBN 1-55899-762-8) |
| Mehner,J.; Doetzel,W.; Gessner,T.: Advanced Technologies for Microsystems Design. Anniversary book for Prof. Dr. H. Reichl´s 60th birthday, ed. B.Michel & R.Aschenbrenner, 2004, pp 241-245 |
| Mueller,A.-D.; Mueller,F.; Mehner,J.; Gessner,T.; Hietschold,M.: Sensor-actuator arrays for dynamic Atomic Force Microscopy and their application in temporary MESFET devices. Actuator 2004, Bremen (Germany), 2004 |
| Mueller,F.; Long,T.D.; Mueller,A.-D.; Gessner,T.; Hietschold,M.: Resonance shifts in capacitively controlled actuator arrays. Actuators 2004, Bremen (Germany), 2004 |
| Nestler,J.; Baum,M.; Otto,T.; Gessner,T.: Potentials for Microsystems in Biotechnology and Healthcare. 6th International Scientific Conference SATERRA, Mittweida (Germany), 2004 Nov 11-13; Scientific Reports of the Hochschule Mittweida, 6'2004 (2004) pp 1-4 (ISSN 1437-7624) |
| Otto,T.; Nestler,J.; Baum,M.; Gessner,T.: Mikrofluidische Vorrichtung für die optische Analyse. Patentschrift (DE 102004015906B4) |
| Otto,T.; Saupe,R.; Kaufmann,C.; Gessner,T.: Infrared Micro Mirror Spektrometer for Gas Analysis. Actuator 2004, 9th International Conference on New Actuators, Bremen (Germany), 2004 June 14-16; Proceedings, pp 254-257 |
| Otto,T.; Saupe,R.; Stock,V.; Fritzsch,U.; Bruch,R.; Gessner,T.: Packaging and Characterization of Miniaturized Spectral Sensing Devices. SPIE Photonics West: MOEMS and Miniaturized Systems IV, San Jose (USA), 2004 Jan 27-28; Proc. of SPIE, 5346 (2004) pp 134-140 |
| Puschmann,R.; Schwarzer,N.; Fruehauf,S.; Richter,F.; Schulz,S.E.; Gessner,T.: Neues Konzept für den Eindruckversuch an porösen Schichten. DPG Frühjahrstagung 2004, 2004 Mar |
| Puschmann,R.; Schwarzer,N.; Richter,F.; Fruehauf,S.; Schulz,S.E.: A usable concept for the indentation of thin porous films. NanoMech Workshop, Hückelhoven, 2004 Sep |
| Reuter,D.; Bertz,A.; Schwenzer,G.; Gessner,T.: Selective adhesive bonding with SU-8 for zero-level-packaging. SPIE Int. Symposium Smart Materials, Nano- and Micro-Smart Systems, Sidney (Australia), 2004 Dec 12-15 |
| Saupe,R.; Otto,T.; Mehner,J.; Kurth,S.; Kaufmann,C.; Gessner,T.: Electrostatic Driven Scanning Micro Mirrors Applied in Spectral Sensing Devices. VDI/VDE/IT mstnews, 03/2004 (2004) pp 40-42 |
| Scheibner,D.; Mehner,J.; Reuter,D.; Kotarsky,U.; Gessner,T.; Doetzel,W.: Characterization and self-test of electrostatically tunable resonators for frequency selective vibration measurements. Sensors and Actuators A, 111 (2004) pp 93-99 |
| Schroeter,B.; Mehner,J.; Hiller,K.; Gessner,T.; Doetzel,W.: A Novel Microactuator Based on the Working Principle of a Step-by-Step Switchgear. Actuator 04 , Bremen (Germany); Proceedings, pp 242-245 |
| Schulz,S.E.: CVD Thin Films for Barrier, Hard Mask, Etch and CMP Stop Application, Short Course Lecture. Advanced Metallization Conference AMC 2004, San Diego (USA), 2004 Oct 18 |
| Schulz,S.E.; Blaschta,F.; Eisener,B.; Fruehauf,S.; Schulze,K.; Seidel,U.; Koerner,H.; Gessner,T.: SiO2 Aerogel ULK Integration into Copper Damascene Interconnects for RF Devices. Advanced Metallization Conference (AMC 2003), Conf. Proc. AMC XIX, MRS Warrendale PA (2004) pp 97-105 (ISBN 1-55899-757-1) |
| Schulz,S.E.; Ecke,R.: Advanced CVD Technology for Diffusion Barrier and Cu Deposition, Invited talk. 3rd International Semiconductor Technology Conference (ISTC 2004), Shanghai, China, 2004 Sep 15-17 |
| Schulze,K.; Schulz,S.E.; Fruehauf,S.; Gessner,T.: Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility. Microelectronic Engineering, 76 (2004) pp 38-45 |
| Schulze,K.; Schulz,S.E.; Fruehauf,S.; Koerner,H.; Seidel,U.; Schneider,D.; Gessner,T.: Improvement of mechanical integrity of ultra low-k dielectric stack and CMP compatibility. Materials for Advanced Metallization (MAM), Brussels (Belgium), 2004 Mar 7-10; Microelectronic Eng., 76 (2004) pp 38-45 |
| Shen,Y.Z.; Leschke,M.; Schulz,S.E.; Ecke,R.; Gessner,T.; Lang,H.: Synthesis of tri-n-butylphosphine copper(I) beta-diketonates and their use in chemical vapour deposition of copper. CHINESE JOURNAL OF INORGANIC CHEMISTRY, 20 (11) (2004) pp 1257-1264 (ISSN 1001-4861) |
| Zimmermann,S.; Ecke,R.; Rennau,M.; Schulz,S.E.; Hecker,M.; Voss,A.; Engelmann,H.-J.; Mattern,N.; Zschech,E.; Gessner,T.: Characterisation of a PECVD WNx Barrier Layer Against Copper Diffusion. Advanced Metallization Conference (AMC 2003), Conf. Proc. AMC XIX, MRS Warrendale PA (2004) pp 397-402 (ISBN 1-55899-757-1) |
