| Ahner,N.; Fischer,T.; Zimmermann,S.; Schaller,M.; Prager,L.; Schulz,S.E.: UV assisted curingg of pplasma damagged porous ultralow‐k materials for a k-recovery process: influence of curing‐cycle modifications (Poster). Advanced Metallization Conference, Baltimore, Maryland (USA), 2009 Oct 13-15 |
| Ahner,N.; Schaller,M.; Bartsch,C.; Baryschpolec,E.; Schulz,S.E.: Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions. Solid State Phenomena, 145-146 (2009) pp 319-322 |
| Ahner,N.; Schulz,S.E.; Zacher,M.: Surfactants as an Additive to Wet Cleaning Solutions for Plasma Etch Residue Removal: Compatibility to a Porous CVD-SiCOH Ultra Low-k Dielectric Material . 216th ECS Meeting , Vienna, Austria, October 4 - October 9 2009; ECS Transactions, Volume 25 Issue 5 (2009) pp 87-94 |
| Baum,M.: Monitoring von Human-Endoprothesen mit Mikrosensoren. 126. Kongress der deutschen Gesellschaft für Chirurgie, München (Germany), 2009 May 1; Vortrag |
| Baum,M.; Boese-Landgraf,J.; Gessner,T.: Mikrosensoren überwachen Endoprothesen. 10. Würzburger Medizintechnik Kongress, Würzburg (Germany), 2009 May 11-13; Proceedings, pp 83-87 (ISBN 978-3-937988-08-4) |
| Baum,M.; Boese-Landgraf,J.; Gessner,T.: Möglichkeiten zur in-vivo Zustandsbestimmung von Gelenkendoprothesen. Deutscher Kongress für Orthopädie und Unfallchirurgie, Berlin, 2009 Oct 21-24; Vortrag |
| Baum,M.; Braeuer,J.; Hofmann,L.; Froemel,J.; Wiemer,M.; Gessner,T.; Letsch,H.: Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem. Patentanmeldung (DE102009006822 & WO09941) |
| Baum,M.; Hofmann,L.; Wiemer,M.; Gessner,T.: Solid-Liquid-Interdiffusion Bonding für 3D-Integration und Wafer-Level-Packaging. Mikrosystemtechnik-Kongress, Berlin, 2009 Oct 12-14; Proceedings |
| Bonitz,J.; Hermann,S.; Loschek,S.; Liu,P.; Schulz,S.E.: Selective deposition of aligned carbon nanotubes for NEMS applications. GMM-Workshop “Mikro-Nano-Integration”, Seeheim, 2009 Mar 12-13 (ISBN 978-3-8007-3155-8) |
| Braeuer,J.; Baum,M.; Wiemer,M.; Gessner,T.: Using of reactive multilayer systems for room temperature bonding of micro components. Smart Systems Integration, Brussels, 2009, Mar 10-11; Proceedings |
| Brandenburg,A.; Curdt,F.; Nestler,J.; Otto,T.; Wunderlich,K.; Michel,D.: Integrated point of care testing system based on low cost polymer biochips. SPIE Photonics West 2009, San Diego, 2009 Jan 24-29; Proceedings, 7169 (2009) p 716902 (11 pages) |
| Ecke,R.; Froemel,J.; Schulz,S.E.; Wiemer,M.; Gessner,T.: Process Development for Smart Systems Integration in MEMS. mst news, 03/09 (2009) pp 35-36 |
| Froemel,J.; Gessner,T.: Investigations of Bonding Mechanism with Thin Gold Layers . World Premier International Research Center AIMR Annual Workshop, Zao (Japan), 2009 Mar 1-6; Proceedings, p 124 |
| Froemel,J.; Haubold,M.; Wiemer,M.; Gessner,T.: Thermocompresion bonding with gold interfaces. Smart System Integration 2009, Brussels (Belgium), 2009 Mar 10-11; proceedings (ISBN 978-3-89838-616-6) |
| Gessner,T.; Leidich,S.; Nowack,M.; Froemel,J.; Hofmann,L.; Kurth,S.; Bertz,A.: Micro Devices for RF Applications. ISMOT, New Delhi (IND), 2009 Dec 16-19 |
| Gessner,T.; Reuter,D.: Smart Systems Integration by using Micro- and Nanotechnologies. 6th International Multi-Conference on Systems, Signals and Devices, SSD 09, Djerba, Tunesia, 2009 March 23-26; Proceedings |
| Guttmann,M.; Kaiser,K.; Muth,S.; Moritz,M.; Schmidt,R.; Zwanzig,M.; Hofmann,L.; Schubert,I.: Neues modulares Anlagenkonzept für nasschemsiche Ätzprozesse und Wafergalvanoformung. Galvanotechnik, 11/2009 (2009) pp 2616-2624 (ISBN ISSN 0016-4232 B 20696) |
| Hansel,T.; Grunwald,R.; Reimann,K.; Bonitz,J.; Kaufmann,C.; Griebner,U.: Deformation Measurements of High-Speed MEMS With Combined Two-Wavelength Single-Pulse Digital Holography and Single Phase Reconstruction Using Subpicosecond Pulses. IEEE Journal of Selected Topics in Quantum Electronics, 15, 5 (2009) pp 1351-1358 (ISSN 1077-260X) |
| Hansel,T.; Steinmeyer,G.; Grunwald,R.; Falldorf,C.; Bonitz,J.; Kaufmann,C.; Kebbel,V.; Griebner,U.: Synthesized femtosecond laser pulse source for two-wavelength contouring with simultaneously recorded digital holograms. Optics Express, 17 (2009) pp 2686-2695 (ISSN 1094-4087) |
| Hofmann,L.; Braeuer,J.; Baum,M.; Schulz,S.E.; Gessner,T.: Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration. Talk; 2009 Advanced Metallization Conference (AMC 2009), Baltimore, MD (USA), 2009 Oct 13-15 |
| Jia,C.; Baum,M.; Froemel,J.; Schubert,I.; Wiemer,M.; Gessner,T.; ArnoldSchneider; PeterFrey; HolgerRank; AchimTrautmann: An Investigation of Cu-Cu Thermal Compression Wafer Bonding. Conference on Wafer Bonding for Microsystems and Wafer Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, France, 2009 Dec 06-09 |
| Jia,C.; Wiemer,M.; Grunert,J.; Otto,T.; Gessner,T.: A novel method for the fabrication of deep-submicron structure. Smart System Integration 2009, Bruessel, Belgien, 2009 Mar 10-12 |
| Jia,C.; Wiemer,M.; Werner,T.; Otto,T.; Gessner,T.: Two Lithography-Based Technologies for the Fabrication of Submi-cron to Deep-Submicron Structures. GMM Conference on Micronano Integration, Seeheim, Germany, 2009 Mar 12-13 (ISBN 978-3-8007-3155-8, ISSN 1432-3419) |
| Leidich,S.; Braun,M.; Gessner,T.; Riemer,T.: Silicon Cylinder Spiral Coil for Nuclear Magnetic Resonance Spectroscopy of Nanoliter Samples. Concepts in Magnetic Resonance Part B (Magnetic Resonance Engineering), 35B(1) (2009) pp 11-22 |
| Lin,Y.; Baum,M.; Haubold,M.; Froemel,J.; Wiemer,M.; Gessner,T.; Esashi,M.: Characterization of eutectic wafer bonding using Gold and Silicon. Smart Systems Integration 2009, Brussels (Belgium), 2009 Mar 10-11; Proceedings, pp 56-63 (ISBN 978-3-89838-616-6) |
| Lin,Y.; Baum,M.; Haubold,M.; Froemel,J.; Wiemer,M.; Gessner,T.; Esashi,M.: Development and Evaluation of AuSi Eutectic Wafer Bonding. Transducers 2009, Denver (USA), 2009 June 21-25; Proceedings, 15th International Conference on Solid-State Sensors and Microsystems (2009) pp 244-247 (ISBN 978-1-4244-4193-8) |
| Lin,Y.; Froemel,J.; Esashi,M.; Gessner,T.: Characterisation of Gold and Silicon Eutectic for Wafer Bonding Applications. World Premier International Research Center AIMR Annual Workshop, Zao (Japan), 2009 Mar 1-6 |
| Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Theoretical study of geometry dependent I-V characteristics of copper and gold quantum point contacts. DPG, Dresden (Germany), 2009 Mar 22-27; Poster Presentation |
| Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Electronic transport properties of copper atomic wires. AMC, Baltimore MD (USA), 2009 Oct 13-15; Poster Presentation |
| Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Geometry dependent of I-V characteristics of gold atomic-sized contacts. 9th IEEE Conference on Nanotechnology, Genoa (Italy), 2009 Jul 26-30; Oral Presentation |
| Morschhauser,A.; Hammerschmidt,J.; Nestler,J.; Jahn,S.F.; Baumann,R.; Gessner,T.; Wachner,D.; Goedel,W.A.: Hierarchisches mikrofluidisches System. MikroSystemTechnik KONGRESS 2009, Berlin, 2009 Oct 12-14; Proceedings, pp 693-695 (ISBN 978-3-8007-3183-1) |
| Morschhauser,A.; Nestler,J.; Gessner,T.; Wachner,D.; Goedel,W.; Jahn,S.; Baumann,R.: Verfahren zur Herstellung eines mikrostrukturierten Films und mikrostrukturierter Film. Patentanmeldung (DE102009006064) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Auerswald,J.; Knapp,H.F.; Gavillet,J.; Gessner,T.: Polymer lab-on-chip systems with integrated electrochemical pumps suitable for large scale fabrication. Int. J. Adv. Technol., in press (2009) (ISSN 0268-3768) |
| Nestler,J.; Schueller,M.; Morschhauser,A.; Otto,T.; Gessner,T.; Brandenburg,A.; Michel,D.; Bier,F.F.: Lowcost in-vitro diagnostic cartridges with integrated sensor,
micropumps and reagents. Smart Systems Integration, Brussels, 2009 Mar 10-11; Proceedings (ISBN 978-3-89838-616-6) |
| Neumann,N.; Ebermann,M.; Hiller,K.; Kurth,S.: Novel MWIR microspectrometer based on a tunable detector. MOEMS and Miniaturized Systems VIII, San Jose; Proc. of SPIE, Vol. 7208 (2009) |
| Nowack,M.; Reuter,D.; Bertz,A.; Gessner,T.: Integration of MEMS Inertial Sensors in Smart RFID Labels for Transport Monitoring of Sensitive Goods. Mikrosystemtechnik Kongress 2009, Berlin, 2009 Oct 12-14; Proceedings (ISBN 978-3-8007-3183-1) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Throl,O.; Graehlert,W.; Kaskel,S.; Schreck,H.; Gessner,T.: MEMS ANALYZER FOR FAST DETERMINATION OF MIXED GASES. MEMS/MOEMS Conference, San Jose, 2009; Proceedings of SPIE |
| Reuter,D.: Entwicklung einer Dünnschichtverkappungstechnologie für oberflächennahe Mikrostrukturen, p 208 (ISBN 978-3-941003-07-1) |
| Reuter,D.; Nowack,M.; Bertz,A.; Wiemer,M.; Semar,R.; Hopp,K.-F.; Dietrich,S.; Thieme,T.; Herbst,K.; Gessner,T.: Integration of Inertial MEMS Sensors in Active Smart RFID Labels for Transport Monitoring. Smart Systems Integration, Brussels, 2009 Mar 10-11; Proceedings (ISBN 978-3-89838-616-6) |
| Reuter,D.; Nowack,M.; Rennau,M.; Bertz,A.; Wiemer,M.; Kriebel,F.; Gessner,T.: Hermetic Thin Film Encapsulation of Mechanical Transducers for Smart Label Applications. Transducers 09, Denver (USA), 2009 Jun 21-25; Tech. Digest |
| Schulz,S.E.; Waechtler,T.; Hofmann,L.: Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials. Invited Talk; Advanced Metallization Conference 2009, 19th Asian Session (ADMETA 2009), Tokyo (Japan), 2009 Oct 19-21 |
| Schulze,K.; Schulz,S.E.; Koerner,H.; Gessner,T.: Airgap Integration: Fabrication by Sacrificial Etch, Thermal and Mechanical Behavior, Reliability (Talk). Materials for Advanced Metallization (MAM), Grenoble (France), 2009 Mar 8-11 |
| Schulze,K.; Schulz,S.E.; Koerner,H.; Gessner,T.: Airgap Structures by using Sacrificial Wet Etch: Fabrication, Thermal and Mechanical Behaviour, Reliability. MRS Conf. Proc. AMC XXIV, Materials Research Society, Warrendale PA (2009), pp 41-52 (ISBN 1048-0854 / ISSN 978-1-60511-125-4) |
| Vogel,K.; Shaporin,A.; Wuensch,D.; Billep,D.: Crack propagation in micro-chevron-test samples of direct bonded wafers
. 26th Danubia-Adria Symposium on Advances Experimental Mechanics, Leoben (Austria), 2009 Sep 23-26 |
| Wachner,D.; Goedel,W.; Hammerschmidt,J.; Jahn,S.; Baumann,R.; Morschhauser,A.; Nestler,J.; Gessner,T.; Otto,T.: Mikrofluidische Einrichtung und Verfahren zur Herstellung einer mikrofluidischen Einrichtung. Patentanmeldung (DE102009006065) |
| Waechtler,T.; Gessner,T.; Schulz,S.; Lang,H.; Jakob,A.: Substrate having a coating comprising copper and method for the production thereof by means of atomic layer deposition. Patent Application Publication , WO 2009/071076 A1 (2009) |
| Waechtler,T.; Hofmann,L.; Mothes,R.; Schulze,S.; Schulz,S.E.; Gessner,T.; Lang,H.; Hietschold,M.: Copper Oxide ALD from a Cu(I) beta-Diketonate: Growth Studies and Application as Seed Layers for Electrochemical Copper Deposition. 216th ECS Meeting, Vienna (Austria), 2009 Oct 4-9 |
| Waechtler,T.; Hofmann,L.; Schulz,S.E.: Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials. Invited Talk; 2009 Advanced Metallization Conference (AMC 2009), Baltimore, MD (USA), 2009 Oct 13-15 |
| Waechtler,T.; Oswald,S.; Roth,N.; Jakob,A.; Lang,H.; Ecke,R.; Schulz,S.E.; Gessner,T.; Moskvinova,A.; Schulze,S.; Hietschold,M.: Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2. J. Electrochem. Soc., 156 (2009) pp H453-H459 (ISSN 0013-4651) |
| Waechtler,T.; Roth,N.; Mothes,R.; Schulze,S.; Schulz,S.E.; Gessner,T.; Lang,H.; Hietschold,M.: Copper Oxide ALD from a Cu(I) beta-Diketonate:
Detailed Growth Studies on SiO2 and TaN
. ECS Trans., 25 (2009) pp 277-287 (ISSN 1938-5862) |
| Waechtler,T.; Schulze,S.; Hofmann,L.; Hermann,S.; Roth,N.; Schulz,S.E.; Gessner,T.; Lang,H.; Hietschold,M.: Detailed Study of Copper Oxide ALD on SiO2, TaN, and Ru. AVS 9th International Conference on Atomic Layer Deposition (ALD 2009), Monterey, CA (USA), 2009 Jul 19-22 |
| Wegener,M.; Greco,T.; Arlt,K.; Schuberth,R.; Morschhauser,A.; Otto,T.: Ferroelectric P(VDF-TrFE) as a large-scale piezoelectric sensor in a table-tennis racquet. Applications of Ferroelectrics, 2009. ISAF 2009. 18th IEEE International Symposium on the, Xian, Aug 23-27 pp 1-5 (ISBN 978-1-4244-4970-5) |
| Wiemer,M.; Wuensch,D.; Braeuer,J.; Eichler,M.; Hennecke,P.; Gessner,T.: Low temperature bonding of hetero-materials using ambient pressure plasma activation. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Grenoble (France), 2009 Dec 6-8 |
| Zhong,Zh.; Mohammadzadeh,S.; Cao,Y.; Qiu,Zh.; Liu,R.; Streiter,R.; Gessner,T.: Electrical resistivity calculations for copper nanointerconnect. MAM, Grenoble (France), 2009 Mar 9-11; Poster Presentation |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Ruelke,H.; Schulz,S.E.; Gessner,T.: Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS. Materials for Advanced Metallization MAM 2009, Grenoble (France), 2009 Mar 9-11 |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma. Materials for Advanced Metallization MAM 2010, Mechelen (Belgium), 2010 Mar 7-10 |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Talk: Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods. AMC 2009, Baltimore (USA), October 13-15, 2009; Advanced Metallization Conference |
| Zimmermann,S.; Blaschta,F.; Schaller,M.; Ruelke,H; Schulz,S.E.; Gessner,T.: Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as in situ diagnostic methods. AMC, San Diego (USA); Proceedings of the Advanced Metallization Coneference 2008, pp 387-392 (ISBN 978-1-60511-125-4) |
| Zong,Zh.; Mohammadzadeh,S.; Cao,Y.; Qiu,Zh.; Liu,R.; Streiter,R.; Gessner,T.: Electrical resistivity calculations for copper nanointerconnect. Microelectronic Eng., 87, 3 (2009) pp 402-405 |
