| Alves da Silva,L.; Hartmann,M.; Boettger,S.; Hermann,S.: High-Performance CNT-Based FETs on 200 mm Si Wafers With Low Drift and aM-Level Biosensing Sensitivity. IEEE Sensors Letters, 9, 10 (2025) pp 1-4 |
| Boehm,L.; Kohlschreiber,P.; Haase,M.; Helke,C.; Reuter,D.: Influence of substrate properties and addition of oxygen on the process of reactive ion etching to optimize the nanopatterning of silicon structures. MNE - International Micro and Nao Engineering Conference 2025, Southampton (UK), 2025 Sept 15-18; Proceedings, pp pp 1-2 |
| Boettger,S.; Iffland,T.; Hartmann,M.; Alves da Silva,L.; Saupe,R.; Hermann,S.: Repealing the Responsivity to Selectivity-Compromise of Carbon Nanotube-based Hydrogen Sensors by Polymer/Noble-Metal Functionalization. IEEE Sensors, Vancouver, 2025 Oct 20-22; Proceedings |
| Gottwald,M.; Kohlschreiber,P.; Kathiriya,D.; Schermer,S.; Helke,C.; Reuter,D.; Sendel,M.; Biller,H.: Development of an intra-level mix-and-match lithography process using negative-tone photoresist AR-N 4400-10 S4 to combine i-line stepper and electron beam exposure. 40th European Mask and Lithography Conference (EMLC 2025), Dresden, 23. September 2025; Proc. SPIE 13787, 137871H (2025) |
| Gottwald,M.; Schermer,S.; Ambar,R; Kohlschreiber,P.; Helke,C.; Biller,H.; Sendel,M.; Reuter,D.: Investigation of Intra-Level Mix-and-Match lithography approach in AR-N 7520new for use in a Mix-and-Match grayscale lithography process. MNE - International Micro and Nao Engineering Conference 2025, Southampton (UK), 2025 Sept 15-18; Proceedings, pp pp 1-2 |
| Hartmann,M.; Ernst,M.; Boettger,S.; Hermann,S.: CNTFET Metal Contact Investigations via Voltage Controlled Material Deposition . NanoTube'25, Kyoto, 2025 Jun 15. -20.; Poster |
| Hartmann,M.; Ernst,M.; Boettger,S.; Hermann,S.: Carbon Nanotube Technology for Future Radio Frequency Communication. Global Young Scientists Summit, Singapur, 2025 Jan 06.-10.; Poster |
| Helke,C.; Schermer,S.; Borisov,M.; Chelubeev,D; Chernik,V; Rakhovskiy,V; Shamaev,A; Spoerl,C; Konstantinou,G; Meer,H; Reuter,D.: Validation of Sub Wavelength Holographic Lithography in a Semiconductor Related Approach within the EU Funded Project HoliSTEP. EMLC - European Mask and Lithography Conference 2025, Dresden, 2025 Jun 16-18; Proceedings, pp pp. 1-2 |
| Helke,C.; Schermer,S.; Gottwald,M.; Kohlschreiber,P.; Bonitz,J.; Haase,M.; Umlauf,G.; Reuter,D.: 3D Patterning by Electron Beam and I-line Grayscale Lithography Combined with RIE, DRIE and IBE for Photonic Applications. PESM - Plasma Etch And Strip In Microtechnology 2025, Chemnitz, 2025 Jun 16-17; Proceedings, pp pp. 1-2 |
| Hosseini,V.; Valaboju,B.; Umlauf,G.; Haase,M.; Anderson,D.; Reuter,D.: New approach for Silicon Etching: Low-Pressure Vapor-Phase Metal-Assisted Chemical Etching via Catalytic Metal Nanostructures for Advanced Microfabrication. Plasma Etch and Strip in Microtechnology (PESM 2025), June |
| Kohlschreiber,P.; Gottwald,M.; Helke,C.; Biller,H.; Sendel,M.; Reuter,D.: Evaluation of HSQ resist Medusa 84 SiH regarding suitability for various process windows. 40th European Mask and Lithography Conference (EMLC 2025), Dresden, 23. September 2025; Proc. SPIE 13787, 137871E (2025) (2025) |
| Kohlschreiber,P.; Gottwald,M.; Helke,C.; Biller,H.; Sendel,M.; Reuter,D.: Evaluation of HSQ Resist Medusa 84 SiH regarding suitability for various process windows. Proceedings, pp pp 1-2 |
| Kohlschreiber,P.; Gottwald,M.; Helke,C.; Biller,H.; Sendel,M.; Reuter,D.: Investigation of process windows for alternative non-toxic and metal ion free developer choline hydroxide for HSQ resist Medusa 84 SiH. MNE - International Micro and Nao Engineering Conference 2025, Southampton (UK), 2025 Sept. 15-18; Proceedings, pp pp 1-2 |
| Mehraban,Z.; Sayyed,M.; Zieger,S.; Seifert,T.; Haase,M.; Stoll,M.; Langer,J.; Kuhn,H.: Process Data-Driven Virtual Metrology for Bosch Etching: A Gaussian Process Approach Integrating Stationarity Analysis and Functional Principal Component Analysis.[Poster]. |
| Mehraban,Z.; Sayyed,M.A.; Zieger,S.; Seifert,T.; Haase,M.; Stoll,M.; Langer,J.; Kuhn,H.: Process Data-Driven Virtual Metrology for Bosch Etching: A Gaussian Process Approach Integrating Stationary Analysis and Functional Principal Component Analysis [Poster]. Plasma Etch and Strip in Microtechnology (PESM 2025)., June |
| Mulay,S.; Stoeckel,C.; Ullmann,D.; Meinel,K.; Reuter,D.: Universal PMUTS–Piezoelectric Micromachined Ultrasonic Transducers With An Automatic Wire Bond Process For Adaptive Acoustic Channels. 2025 Smart Systems Integration Conference and Exhibition (SSI), Czech Republic (Prague), 2025 08-10 Apr (ISBN 979-8-3315-1244-6) |
| Qu,J; Hu,X.; Deconinck,M; Liu,L; Cheng,Y; Zhao,R; Wang,M; Zhang,H; Vaynzof,Y; Schuster,J.; Cabot,A; Leistner,K; Li,F: Trisodium Citrate-Assisted Synthesis of Edge-Abundant Nickel-Iron Layered Double Hydroxides for Efficient Oxygen Evolution Reaction. ChemCatChem, 17 (2025) p e202401667 |
| Rothe,T.; Lauff,A.; Shaporin,A.; Thieme,P.; Sayyed,M.A.; Gottfried,K.; Schuster,J.; Langer,J.; Jaeckel,L.; Stoll,M.; Kuhn,H.: Real-Time Interfacial Pressure Prediction in CMP Using Machine Learning Surrogates of Finite Element Simulations. International Journal of Automation Technology, 19, 5 (2025) pp 879 - 889 (ISSN 1881-7629) |
| Sayyed,M.A.; Seifert,T.; Zieger,S.; Schwarzenberg,S.; Deshmukh,A; Haase,M.; Langer,J.: A Multi-Model Dataset for BOSCH Plasma-Etching: Optical Emission Spectra, Process Parameters, and Wafer Measurements for Data-Driven Plasma Modeling. Zenodo |
| Sayyed,M.A.; Zieger,S.; Seifert,T.; Langer,J.; Haase,M.; Kuhn,H.: Hybrid Spectral Data Compression for Efficient and Interpretable BOSCH Process Monitoring. IEEE International Conference on Plasma Science (ICOPS 2025), June |
| Sayyed,M.A.; Zieger,S.; Seifert,T.; Rothe,T.; Langer,J.; Haase,M.; Kuhn,H.: Automatic Feature Extraction from Optical Emission Spectra of Reactive Ion Etching Using Dynamic Mode Decomposition. Plasma Processing and Technology International Conference (Plasma Tech 2025), April |
| Schermer,S.; Bieling,J.; DeMoor,S.; Zanzal,A.; Reynolds,P.; Helke,C.; Bonitz,J.; Voigt,A.; Reuter,D.: Optimizing reticle based high throughput i-line grayscale projection lithography for 3D structures with low surface roughness. Micro and Nano Engineering, 28 (2025) |
| Schermer,S.; DeMoor,S.; Zanzal,A.; Reynolds,P.; Bonitz,J.; Bieling,J.; Helke,C.; Voigt,A.; Reuter,D.: Optimizing reticle based high throughput i-line grayscale projection lithography for 3D structures. MNE - International Micro and Nao Engineering Conference 2025, Southampton (UK), 2025 Sept 15-18; Proceedings, pp pp 1-2 |
| Schermer,S.; DeMoor,S.; Zanzal,A.; Reynolds,P.; Helke,C.; Voigt,A.; Reuter,D.: High throughput i-line grayscale exposure for 3D optical components and MEMS applications. EMLC - European Mask and Lithography Conference 2025, Dresden, 2025 Jun 16-18; Proceedings, pp pp 1-2 |
| Schermer,S.; Gottwald,M.; Kohlschreiber,P.; Bonitz,M.; Haase,M.; Umlauf,G.; Reuter,D.: 3D Patterning by Electron Beam and I-line Grayscale Lithography Combined with RIE, DRIE and IBE for Photonic Applications. PESM - Plasma Etch And Strip In Microtechnology 2025, Chemnitz, 2025 Jun 16-17; Proceedings, pp pp. 1-2 |
| Schermer,S.; Helke,C.; Haase,M.; Gottwald,M.; Kohlschreiber,P.; Bonitz,J.; Umlauf,G.; Hiller,K.; Reuter,D.: Sophisticated 3D Patterning by E-Beam and i-line Grayscale Lithography and followed RIE and DRIE structure transfer to enable future photonic, NEMS and MEMS application fields. MST2025; Proceedings, pp 1-4 |
| Schmid,M.; Boettger,S.; Ernst,M.; Hermann,S.; Kavun,E.; Katzenbeisser,S.: Nanomaterial-based platform electronics for PUF circuits with extended entropy sources (NanoSec2). DATE25, Lyon, 2025 Feb 2; Poster |
| Seifert,T.; Haase,M.; Sayyed,M.A.; Kuechler,M.; Zieger,S.; Langer,J.; Reuter,D.: Analysis in Deep Reactive Ion Etching Processes Using Optical Emission Spectroscopy and k-Means Clustering [Poster]. Plasma Etch and Strip in Microtechnology (PESM 2025)., June |
| Seifert,T.; Sayyed,M.A.; Kuechler,M.; Zieger,S.; Langer,J.; Reuter,D.; Haase,M.: Optical Emission Spectroscopy Analysis of the BOSCH Process Utilizing k-Means Clustering and Dynamic Mode Decomposition. IEEE International Conference on Plasma Science (ICOPS 2025), June |
| Selbmann,F.; Schaller,F.; Song,S.; Kuehn,M.; Roscher,F.; Zimmermann,S.; Kuhn,H.: Parylene C based memristors for the realization of ultra-thin and flexible smart systems. 2025 Smart Systems Integration Conference and Exhibition, SSI 2025, Prague (Czech Republic), 2025 Apr 8-10; Proceedings (ISBN 979-833151244-6) |
| Selvam,K.; Saeidi,N.; Schwarzmann,Y.; Wiemer,M.; Kuhn,H.: Investigation of Capacitive Micromachined Ultrasound Transducer for NDT and material inspection in metals and alloys. 2025 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2025, Chemnitz (Germany), 2025 May 19-22; Proceedings (ISBN 979-833150500-4, 1091-5281) |
| Shaporin,A.; Forke,R.; Wecker,J.; Tank,F; Seifert,T.; Hiller,K.; Schumann,A.-K.; Stoeckel,C.; Reuter,D.: Optomechanical Inertial Sensors Based on Ring Resonators: Design Approaches and Technology. 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025 Apr 6-9; Proceedings, 26 (2025) pp 1-6 |
| Song,S.; Diyatmika,W.; Ruhl,G.; Van Dyck,S.; Heller,R.; Busch,A.; Zimmermann,S.; Hess,J: Influence of Sputtering Parameters on the Stoichiometry and Crystallization Behavior of Germanium Telluride (GeTe) Films Grown by Confocal Magnetron Sputtering. E/PCOS 2025 Conference, Marseille (France), 2025 Sep 24-26; Poster |
| Zhao,Z.; Doering,H.; Blangiardi,F.; Gottschall,N.; Schwarzenberg,S.; Beltran,R.B.; Doering,A.; Maier,D.; Streiter,R.; Langer,J.; Heinkel,U.; Kuhn,H.: SenMooVe: A Platform for Sensor-based Air Quality Monitoring in Public Transport Vehicles. 2025 Smart Systems Integration Conference and Exhibition, SSI 2025, Prague (Czech Republic), 2025 Apr 8-10; Proceedings (ISBN 979-833151244-6, 979-8-3315-1245-3) |
| Zieger,S.; Sayyed,M.A.; Seifert,T.; Haase,M.; Curato,I.V.; Langer,J.; Kuhn,H.: Virtual Metrology for the Bosch Process: A Knowledge-Driven Approach to Spectral Data Compression. Plasma Etch and Strip in Microtechnology (PESM 2025), June |
| Zieger,S.; Sayyed,M.A.; Seifert,T.; Haase,M.; Curato,I.V.; Langer,J.; Kuhn,H.: Automating spectral data compression for the Bosch process. European Conference of Advanced Process Control and Manufacturing (apc|m 2025)., April |
| Zienert,A.; Jaeckel,L.; Schuster,J.; Zeun,A.; Seidel,A.-S.; Simon,D.K.; Fiedler,O.: Simulation of Si Epitaxy in Single Wafer Reactors. Si-Epi usermeeting, Dresden, 2025 Oct 21-22; Oral presentation |
| Zienert,A.; Simon,D.K.; Fiedler,O.; Schuster,J.: Simulation of Gas Flow and Multicomponent Diffusion in a Single Wafer Silicon Epitaxy Reactor. COMSOL Conference 2025, Amsterdam, 2025 Oct 29-31; Poster presentation |
