Technologies for micro and nano systems

Prof. Dr. T. Geßner, Prof. Dr. K. Hiller

Forms of teaching and examination

The module is devided into lectures and tutorials (§ 4):

• L: Technologies for Micro and Nano Systems (2 LVS)
• T: Technologies for Micro and Nano Systems (2 LVS)

The module ends with a final written exam (120 minutes).
If you successfully passed the exam, you can award 5 credit points. The evaluation of the exam follows the examination regulations (§ 10).
This module is offered once a year and has a duration of one semester.

Objectives and contents

Objectives are: understanding of technology steps and technology process flows for MEMS and NEMS components and systems, technologies for advanced MEMS and NEMS, technologies for system integration.
Contents:

• Process steps for Si MEMS/NEMS (doping, layer deposition, lithography, 3D patterning, thinning, wafer bonding)
• Process steps for non-Si NEMS/MEMS (layer deposition, molding, embossing, mounting)
• Si-based technologies (bulk, surface, high aspect ratio, thin film encapsulation)
• Technologies based on alternative materials (LIGA, polymer based process flows)
• Packaging and 3D integration technologies
• Measurement techniques for MEMS/NEMS
• Examples of Si MEMS (spectrometers, inertial sensors, RF MEMS, actuators)
• Examples of non-Si MEMS (large area tactile arrays, fluidic systems, lab on chip)
• Examples of nanocomponents and NEMS (nanoresonators, surface Plasmon resonance, sub-wavelengh gratings)
• Examples of smart systems
• Trends and roadmaps

Lecture

1. 1 Introduction / Overview
2. 1. I Special offer: Basic processes for microelectronics and microsystem technology
   2. 1. I.1 Cleanroom/fabrication environment
      2. I.2 Single crystallin Si as basic material
      3. I.3 Wafer cleaning
      4. I.4 PVD
      5. I.5 CVD
      6. I.6 Oxidation
      7. I.7 Diffusion
      8. I.8 Ion implantation
      9. I.9 Lithography/Mask fabrication
      10. I.10 Pattern transfer/etching
      11. I.11 Waferbonding
      12. I.12 Packaging
      13. I.13 Measuring technique for process control
3. 2 Process steps for Si based MEMS/NEMS
4. 1. 2.1 Wafer thinning
   2. 2.2 Electroplating
   3. 2.3 Nano patterning (e.g. nanoimprinting)
   4. 2.4 3D Si patterning (e.g. amorphous Si)
   5. 2.5 3D glass patterning
   6. 2.6 Wafer bonding approaches for integration
5. 3 Technologies for Si based MEMS/NEMS
6. 1. 3.1 Bulk technologies
   2. 3.2 Surface MM based on poly-Si, poly-refill
   3. 3.3 HARSE (SCREAM / AIM / LISA / BDRIE)
   4. 3.4 Thin film encapsulation
7. 4 Examples for Si based MEMS/NEMS
8. 1. 4.1 Acceleration/Inclination/Vibsens
   2. 4.2 Resonators (e.g. nanoresonators)
   3. 4.3 Gyroscopes
   4. 4.4 RF-MEMS
   5. 4.5 Spectrometers
9. 5 New materials for more functionality and integration
10. 1. 5.1 PZT
    2. 5.2 polymeric nanocomposites
11. 6 Process steps for non-Si MEMS/NEMS
12. 1. 6.1 Thick film deposition
    2. 6.2 Printing
    3. 6.3 hot embossing
    4. 6.4 injection molding
13. 7 Technologies for non-Si MEMS/NEMS
14. 1. 7.1 LIGA
15. 8 Examples for non-Si MEMS/NEMS
16. 1. 8.1 passive and active microfluidics
    2. 8.2 SPR-sensor - SEMOFS
    3. 8.3 polymeric pressure sensor/table tennis racket
17. 9 3D Wafer level, integration MEMS+ASIC (example: smart label
18. 10 MEMS/NEMS measurement techniques, wafer level testing

Scripts

Scripts and other teaching materials are available only for students and employees of the Chemnitz University of Technology.

• Indroduction, Overview  (3.5 MB)

Special offer:

• Cleanroom  (2.2 MB)
• Material Si  (2.1 MB)
• Cleaning  (940 KB)
• PVD  (2.3 MB)
• CVD  (2.9 MB)
• Oxidation  (2 MB)
• Diffusion  (1.1 MB)
• Implantation  (1.4 MB)
• Lithografie  (3.5 MB)
• Etching  (2.8 MB)
• Waferbonden  (2.8 MB)
• Packaging  (5.5 MB)
• Measuring technique  (1.6 MB)

Contents:

• Wafer Thinning  (854 KB)
• Electroplating  (426 KB)
• Nano Patterning  (1.6 MB)
• 3D Si Patterning  (1.9 MB)
• Glass Patterning  (1.8 MB)
• Waferbonding  (5.1 MB)
• Bulk  (2.3 MB)
• Surface technology  (1.2 MB)
• High aspect ratio micromachining (HARM)  (4.3 MB)
• Encapsulation  (3.7 MB)
• Inertial sensors for acceleration and inclination  (2 MB)
• Resonators  (1.9 MB)
• Angular rate sensors (gyroscopes)  (11.6 MB)
• RF MEMS  (2.9 MB)
• MEMS Spectrometers  (2.1 MB)
• Materials  (1 MB)
• Thick Film Technology  (342 KB)
• Printing  (1.2 MB)
• Hot Embossing  (534 KB)
• Injection Moulding  (523 KB)
• Non silicon technologies  (539 KB)
• Examples for non Si MEMS/NEMS  (2.3 MB)
• Mikrosystems Intergration  (4.2 MB)
• MEMS Measurement  (2.3 MB)