44 Lifetime modeling of copper metallization for SiC power electronics

Autoren: Losbichler, Daniel*; Klingler, Markus; Orso, Steffen; Wunderle, Bernhard
Quelle: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 16-19 April 2023,Graz, Austria
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

43 Evaluation of thermally induced change in sharpness of automotive cameras by coupled thermo-mechanical and optical simulation

Autoren: Pandey, Amit; Unruh, Denis; Kettelgerdes, Marcel; Wunderle, Bernhard; Elger, Gordon
Quelle: SPIE Future Sensing Technologies, 2023, Yokohama, Japan. - SPIE, 2023. - Proceedings : Volume 12327
Erscheinungsjahr: 2023
ISSN: 0277-786X ; ISSN: 1996-756X (electronic) ; ISBN: 9781510659575 ; ISBN: 9781510659582 (electronic)

42 Miniaturized Smart Systems Securing Credence Attributes and Responsibility in Products and Supply Chains

Autoren: Arnold, Marlen G.; Gesmann-Nuissl, Dagmar; Blaudeck, Thomas; Karnaushenko, Daniil; Schmidt, Oliver G.
Quelle: 2023 Smart Systems Integration Conference and Exhibition (SSI), 28-30 March 2023, Brugge, 1-5. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-2506-5 ; Print on Demand(PoD) ISBN: 979-8-3503-0231-8

41 Hollow Microneedle Fabrication and Characterization for Interstitial Fluid Extraction in Minimally Invasive Sensors

Autoren: Enderlein, Tom; Morschhauser, Andreas; Nestler, Jörg; Jobst, Gerhard; Stöhr, Uwe; Selbmann, Franz; Otto, Thomas
Quelle: 2023 Smart Systems Integration Conference and Exhibition (SSI), 2023 March 28-30, Brugge (Belgium). - IEEE Xplore, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-2506-5 ; Print on Demand(PoD) ISBN: 979-8-3503-0231-8

40 Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches

Autoren: Langenickel, Jörn; Selbmann, Franz; Meinecke, Christoph R.; Tanneberger, Nikolas; Wei?, Alexander; Martin, Jörg; Möbius, Martin; Roscher, Frank; Reuter, Danny; Kuhn, Harald
Quelle: 2023 Smart Systems Integration Conference and Exhibition (SSI), 2023 March 28-30, Brugge (Belgium). - IEEE Xplore, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-2506-5 ; Print on Demand(PoD) ISBN: 979-8-3503-0231-8

39 MEMS-Based Fingerprinting Architecture for Trustworthy Electronics

Autoren: Meinel, Katja; Schott, Christian; Mayer, Franziska; Gupta, Dhruv; Mittag, Sebastian; Hahn, Susann; Weidlich, Sebastian; Bülz, Daniel; Forke, Roman; Hiller, Karla; Heinkel, Ulrich; Kuhn, Harald
Quelle: 2023 Smart Systems Integration Conference and Exhibition (SSI), 2023 March 28-30, Brugge (Belgium). - IEEE Xplore, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-2506-5 ; Print on Demand(PoD) ISBN: 979-8-3503-0231-8

38 Greenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming

Autoren: Schlagmann, Moritz; Stoenner, Joseph; Selbmann, Franz; Hess, Stefan; Otto, Thomas
Quelle: 2023 Smart Systems Integration Conference and Exhibition (SSI), 2023 March 28-30, Brugge (Belgium). - IEEE Xplore, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-2506-5 ; Print on Demand(PoD) ISBN: 979-8-3503-0231-8

37 Tunable Fabry-Pérot interferometer integrated in a silicon waveguide of an on-chip optical platform for long infrared wavelengths

Autoren: Wecker, Julia; Hiller, Karla; Großmann, Toni; Hahn, Susann; Kurth, Steffen; Helke, Christian; Küchler, Matthias; Reuter, Danny; Martin, Jörg; Weiß, Alexander; Kuhn, Harald
Quelle: Silicon Photonics XVIII, 2023 28 January - 3 February, San Francisco (California, United States), 1-16. - SPIE, 2023. - Proceedings Volume ; 12426
Erscheinungsjahr: 2023
ISSN: 0277-786X ; ISSN: 1996-756X (electronic) ; ISBN: 9781510659575 ; ISBN: 9781510659582 (electronic)

36 MEMS Cantilever on High-Cycle Fatigue Testing of thin Metal Films

Autoren: Jöhrmann, Nathanael*; Stöckel, Chris; Wunderle, Bernhard
Quelle: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 April 16-19, Graz (Austria). - IEEE Xplore, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

35 AI surrogate models for error analysis in optical systems

Autoren: Meszmer, Peter*; Mundada, Neha; Tavakolibasti, Majid; Wunderle, Bernhard
Quelle: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 16-19 April 2023, Graz Austria. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

34 A Simple Self-Exciting Vibration High Cycle Fatigue Tester for Accelerated Stress Testing of Thin Films

Autoren: Mohammadi, Arash*; Tavakolibasti, Majid; Arnold, Jörg; Wunderle, Bernhard
Quelle: 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 27-29 September, 2023, Budapest, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-1862-3 ; Print on Demand(PoD) ISBN: 979-8-3503-1863-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

33 Multi-scale simulation of epitaxial processes

Autoren: Jäckel, Linda*; Zienert, Andreas; Lorenz, Erik E.; Huber, Max; Schuster, Jörg
Quelle: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023 Ma 22-25, Dresden (Germany). - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-1097-9 ; Print on Demand(PoD) ISBN: 979-8-3503-1098-6 ; Electronic ISSN: 2380-6338 ; Print on Demand(PoD) ISSN: 2380-632X

32 Modeling a Wet Wafer Surface Processing Chain

Autoren: Huber, Max*; Zienert, Andreas; Schuster, Jörg
Quelle: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023 May 22-25, Dresden (Germany. - IEEE Xplore, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-1097-9 ; Print on Demand(PoD) ISBN: 979-8-3503-1098-6 ; Electronic ISSN: 2380-6338 ; Print on Demand(PoD) ISSN: 2380-632X

31 Transport properties of intercalated epitaxial graphene

Autoren: Gruschwitz, Markus; Mamiyev, Zamin; Ghosal, Chitran; Wolff, Susanne; Seyller, Thomas; Tegenkamp, Christoph
Quelle: DPG-Tagung Dresden, 30. März 2023, 16:45–17:00, 2023
Erscheinungsjahr: 2023

30 Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching

Autoren: Franz, Mathias; Junghans, Romy; Schulz, Stefan E.
Quelle: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023 May 22-25, Dresden (Germany). - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-1097-9 ; Print on Demand(PoD) ISBN: 979-8-3503-1098-6 ; Electronic ISSN: 2380-6338 ; Print on Demand(PoD) ISSN: 2380-632X

29 Efficient Quadrature Suppression for Improved Performance of a MEMS Vibratory Gyroscope

Autoren: Forke, Roman; Shaporin, Alexey; Weidlich, Sebastian; Bülz, Daniel; Hiller, Karla; Kuhn, Harald
Quelle: 2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), 2023 March 28-31, Lihue (HI, USA). - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 978-1-6654-5147-5 ; Print on Demand(PoD) ISBN: 978-1-6654-5148-2 ; Electronic ISSN: 2377-3480 ; Print on Demand(PoD) ISSN: 2377-3464

28 An extended Hueckel theory parameterization of Germanium for doped SiGe alloys

Autoren: Dick, Daniel; Fuchs, Florian; Gemming, Sibylle; Schuster, Jörg
Quelle: IWCN, 2023 Jun 12-16, Barcelona, Poster presentation, pp 169-170
Erscheinungsjahr: 2023
ISBN/ ISSN: 978-84-09-51107-5

27 Pulsed infrared thermal imaging as inline quality assessment tool

Autoren: Panahandeh, S.*; May, D.; Grosse-Kockert, C.; Schacht, R.; Ras, M. Abo; Wunderle, Bernhard
Quelle: In: Microelectronics Reliability. - Elsevier BV. - 142. 2023, 114910. - Special issue for EuroSimE 2021
Erscheinungsjahr: 2023
ISBN/ ISSN: 0026-2714

26 Failure Analysis of Sintered Layers in Power Modules Using Laser Lock-in Thermography

Autoren: Panahandeh, S.*; May, Daniel; Grosse-Kockert, C.; Wunderle, B.; Ras, M. Abo
Quelle: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 16-19 April 2023, Graz, Austria. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

25 Validation of the thermal path with one phase liquid cooling for HPC in harsh environment

Autoren: Grün, Tobias; May, Daniel; Straub, Hubert; Jakub, Gromala Przemyslaw; Verleysen, Willem; Wunderle, Bernhard
Quelle: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 16-19 April 2023, Graz, Austria. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

24 Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)

Autoren: Moloudi, Reza*; Grün, Tobias; Verleysen, Willem; Vandevelde, Bart; Cleuren, Silke G.C.; May, Daniel; Wunderle, Bernhard
Quelle: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 16-19 April 2023, Graz, Austria. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

23 Experimental Investigation of Pumped Two-Phase Flow Boiling using Different Finned and Pin Finned Structures on Interchangeable Heater Modules

Autoren: Schacht, Ralph; Gruen, Tobias; Nowak, Torsten; Arnold, Jörg; May, Daniel; Wunderle, Bernhard
Quelle: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 27-29 September 2023, Budapest, Hungary. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN:979-8-3503-1862-3 ; Print on Demand(PoD) ISBN:979-8-3503-1863-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

22 Thermal Test Vehicle for HPC - System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution

Autoren: Sternberg, Maik*; May, Daniel; Pareek, Kaushal Arun; Bader, Volker; Becker, Karl-Friedrich; Wunderle, Bernhard; Abo Ras, Mohamad
Quelle: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 27-29 September 2023, Budapest, Hungary. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN:979-8-3503-1862-3 ; Print on Demand(PoD) ISBN:979-8-3503-1863-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

21 Modelling Creep Behaviour in Sintered Silver using User-Programmable Features in ANSYS

Autoren: Forndran, Freerik*; Heilmann, Jens; Metzler, Martin; Leicht, Markus; Wunderle, Bernhard
Quelle: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 16-19 April 2023, Graz, Austria. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

20 Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading

Autoren: Kniely, Rudolf*; Heilmann, Jens; Huber, Fabian; Wunderle, Bernhard
Quelle: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),16-19 April 2023, Graz, Austria . - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4597-1 ; Print on Demand(PoD) ISBN: 979-8-3503-4598-8 ; Electronic ISSN: 2833-8596 ; Print on Demand(PoD) ISSN: 2833-8553

19 Coupling of Terahertz Light with Nanometer-Wavelength Magnons

Autoren: Salikhov, Ruslan; Ilyakov, Igor; Körber, Lukas; Kákay, Attila; Gallardo, Rodolfo A.; Ponomaryov, Alexey; Deinert, Jan-Christoph; de Oliveira, Thales V. A. G.; Lenz, Kilian; Fassbender, Jürgen; Bonetti, Stefano; Hellwig, Olav; Lindner, Jürge; Kovalev, Sergey
Quelle: 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers), 15-19 May 2023, Sendai, Japan. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-3836-2 ; Print on Demand(PoD) ISBN: 979-8-3503-3837-9

18 In-Vivo Animal Trial of a Fiber-Optic Pressure Sensor Probe with Distributed Sensing Points for the Diagnosis of Lumbar Spinal Stenosis

Autoren: Friedemann, Marvin*; Barz, Susanne; Voigt, Sebastian; Barz, Thomas; Melloh, Markus; Müller, Axel; Mehner, Jan
Quelle: 10th International Conference on Biomedical Engineering and Systems (ICBES'23), 2023 August 03-05, Brunel University, London, United Kingdom, S. 127-1 - 127-9. - Avestia Publishing, 2023. - 9th World Congress on Electrical Engineering and Computer Systems and Sciences (EECSS'23)
Erscheinungsjahr: 2023
ISBN/ ISSN: 2369-811X

17 Development and Evaluation of a Belt Drive Fatigue Tester for Accelerated Thermo-mechanical Stress Testing of Thin Metallic Films on Flexible Substrates

Autoren: Walther, David*; Jöhrmann, Nathanael*; Arnold, Jörg*; Wunderle, Bernhard*
Quelle: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 27-29 September 2023, Budapest, Hungary. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-1862-3 ; Print on Demand(PoD) ISBN: 979-8-3503-1863-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

16 Laser Structured Silicon Based Multi Fourier Horn Resonator

Autoren: Al-Mogahed, Wail; Voigt, Sebastian; Mehner, Philipp Jan; Paschew, Georgi; Richter, Andreas; Mehner, Jan
Quelle: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 28-31 May 2023, Valetta, Malta. - IEEE, 2023
Erscheinungsjahr: 2023
ISBN/ ISSN: Electronic ISBN: 979-8-3503-4131-7 ; Print on Demand(PoD) ISBN: 979-8-3503-4132-4 ; Electronic ISSN: 2768-1874 ; Print on Demand(PoD) ISSN: 2836-8487

15 Boosting complex Systems Research through RSE Collaboration

Autoren: Kelling, Jeffrey*; Tripathi, Richa; Calabrese, Justin M.
Quelle: deRSE23 - Conference for Research Software Engineering in Germany (deRSE23), Paderborn, Germany, 20-22 February 2023 (Session Challenges of Big Projects, Part 1), 2023
Erscheinungsjahr: 2023

14 Implementation and simulation of drift-diffusion models for organic mixed conductor devices

Autoren: Peña Unigarro, Andres David; Günther, Florian
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

13 Simulating neutral biodiversity in large-scale networks

Autoren: Kelling, Jeffrey; Tripathi, Richa; Calabrese, Justin M.
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

12 The self-assembly process of helical molecules

Autoren: Nguyen, Thi N. Ha; Günther, Florian; Preis, Kevin; Kelling, Jeffrey; Tegenkamp, Christoph; Gemming, Sibylle
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

11 Pb-induced proximity effects in epitaxial graphene

Autoren: Pena Unigarro, Andres David; Ghosal, Chitran; Tegenkamp, Christoph; Gemming, Sibylle
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

10 Simulation of proximity effects in epitaxial graphene systems

Autoren: Pena Unigarro, Andres David; Günther, Florian; Gemming, Sibylle
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

9 Simulation of Interaction and Self-assembly of Magnetically Decorated Particles

Autoren: Gemming, Sibylle; Neumann, Maximilian; Steinhäußer, Aaron
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

8 Investigating the influence of stoichiometry-fluctuations on the electronic properties of ultra-scaled HBTs

Autoren: Dick, Daniel; Schuster, Jörg; Fuchs, Florian; Gemming, Sibylle
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

7 Investigation of SiNWs [100] and [111] applying DFT with doping

Autoren: Al-Nuaimi, Nedhal; Hilser, Florian; Gemming, Sibylle
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

6 Efficient integration of short-range models on complex networks

Autoren: Kelling, Jeffrey; Odor, Geza; Barancsuk, Lilla; Deng, Shengfeng; Hartmann, Balint; Gemming, Sibylle
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, Dresden. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

5 Strain effect of the electronic and magnetic properties of thulium iron garnet films

Autoren: Gemming, Sibylle; Salvan, Georgeta; Sharma, Apoorva; Ciubotario, Oana T.; Albrecht, Manfred
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft. - Deutsche Physikalische Gesellschaft, 2023
Erscheinungsjahr: 2023

4 Modeling of the photoluminescence of geminate pairs using a hopping based Monte Carlo simulation

Autoren: Schwuchow, Maik; Thränhardt, Angela; Deibel, Carsten; Gemming, Sibylle
Quelle: Frühjahrstagung der Deutschen Physikalischen Gesellschaft, 2023
Erscheinungsjahr: 2023

3 Magnetization reversal of Co/Pt multilayer systems with weak perpendicular magnetic anisotropy

Autoren: Heinig, Peter; Salikhov, Ruslan; Samad, Fabian; Fallarino, Lorenzo; Kakay, Attila; Hellwig, Olav
Quelle: DPG-Tagung Regensburg, 7. September 2022
Erscheinungsjahr: 2023

2 Influence of adhesion layer and sputter gas pressure on structural and magnetic properties of Co/Pt multilayers

Autoren: Ehler, Rico; Uhlig, Tino; Hellwig, Olav
Quelle: DPG-Tagung Regensburg, 7. September 2022
Erscheinungsjahr: 2023

1 Evidence for perpendicular anisotropy gradients in Co thin films on Pt seeds

Autoren: Patel, Gauravkumar; Stienen, Sven; Salikhov, Ruslan; Gallardo, Rodolfo; Fallarino, Lorenzo; Lenz, Kilian; Lindner, Jürgen; Hellwig, Olav
Quelle: DPG-Tagung Regensburg, 7. September 2022, 2023
Erscheinungsjahr: 2023