On-chip interconnects

Miniaturization leads to faster operating speed for transistors, but rises signal delays (RC-product) in the interconnect system due to smaller structures and increased complexity. Thus, research emphasis is on reduction of RCproduct and associated parasitic effects. For that purpose the application of materials with a low dielectric constant (low-k and ULK dielectrics) is examined. Due to their specific properties like low mechanical strength and inherent porosity, integration of those materials into the entire technology flow is of special importance. Damage-poor patterning and cleaning methods as well as development of repair processes are investigated. As new and alternative technology approach the Air-Gap-technology is considered here.