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Technologies for micro and nano systems

Forms of teaching and examination | Objectives and contents | Lecture

Forms of teaching and examination

The module is devided into lectures and tutorials (§ 4):

  • L: Technologies for Micro and Nano Systems (2 LVS)
  • T: Technologies for Micro and Nano Systems (2 LVS)

Classes are taught in English.

The module ends with a final written exam (120 minutes).

If you successfully passed the exam, you can award 5 credit points. The evaluation of the exam follows the examination regulations (§10).

This module is offered once a year and has a duration of one semester.

Objectives and contents

Objectives are: understanding of technology steps and technology process flows for MEMS and NEMS components and systems, technologies for advanced MEMS and NEMS, technologies for system integration.

Contents:

  • Process steps for Si MEMS/NEMS (doping, layer deposition, lithography, 3D patterning, thinning, wafer bonding)
  • Process steps for non-Si NEMS/MEMS (layer deposition, molding, embossing, mounting)
  • Si-based technologies (bulk, surface, high aspect ratio, thin film encapsulation)
  • Technologies based on alternative materials (LIGA, polymer based process flows)
  • Packaging and 3D integration technologies
  • Measurement techniques for MEMS/NEMS
  • Examples of Si MEMS (spectrometers, inertial sensors, RF MEMS, actuators)
  • Examples of non-Si MEMS (large area tactile arrays, fluidic systems, lab on chip)
  • Examples of nanocomponents and NEMS (nanoresonators, surface Plasmon resonance, sub-wavelengh gratings)
  • Examples of smart systems
  • Trends and roadmaps

Lecture

  1. 1 Introduction / Overview
    1. I Special offer: Basic processes for microelectronics and microsystem technology
      1. I.1 Cleanroom/fabrication environment
      2. I.2 Single crystallin Si as basic material
      3. I.3 Wafer cleaning
      4. I.4 PVD
      5. I.5 CVD
      6. I.6 Oxidation
      7. I.7 Diffusion
      8. I.8 Ion implantation
      9. I.9 Lithography/Mask fabrication
      10. I.10 Pattern transfer/etching
      11. I.11 Waferbonding
      12. I.12 Packaging
      13. I.13 Measuring technique for process control
  3. 2 Process steps for Si based MEMS/NEMS
    1. 2.1 Wafer thinning
    2. 2.2 Electroplating
    3. 2.3 Nano patterning (e.g. nanoimprinting)
    4. 2.4 3D Si patterning (e.g. amorphous Si)
    5. 2.5 3D glass patterning
    6. 2.6 Wafer bonding approaches for integration
  5. 3 Technologies for Si based MEMS/NEMS
    1. 3.1 Bulk technologies
    2. 3.2 Surface MM based on poly-Si, poly-refill
    3. 3.3 HARSE (SCREAM / AIM / LISA / BDRIE)
    4. 3.4 Thin film encapsulation
  7. 4 Examples for Si based MEMS/NEMS
    1. 4.1 Acceleration/Inclination/Vibsens
    2. 4.2 Resonators (e.g. nanoresonators)
    3. 4.3 Gyroscopes
    4. 4.4 RF-MEMS
    5. 4.5 Spectrometers
  9. 5 New materials for more functionality and integration
    1. 5.1 PZT
    2. 5.2 polymeric nanocomposites
  11. 6 Process steps for non-Si MEMS/NEMS
    1. 6.1 Thick film deposition
    2. 6.2 Printing
    3. 6.3 hot embossing
    4. 6.4 injection molding
  13. 7 Technologies for non-Si MEMS/NEMS
    1. 7.1 LIGA
  15. 8 Examples for non-Si MEMS/NEMS
    1. 8.1 passive and active microfluidics
    2. 8.2 SPR-sensor - SEMOFS
    3. 8.3 polymeric pressure sensor/table tennis racket
  17. 9 3D Wafer level, integration MEMS+ASIC (example: smart label
  18. 10 MEMS/NEMS measurement techniques, wafer level testing