BEGIN:VCALENDAR
VERSION:2.0
PRODID:TU Chemnitz
METHOD:PUBLISH
X-WR-CALNAME:Veranstaltungen der TU Chemnitz
X-WR-TIMEZONE:Europe/Berlin
BEGIN:VEVENT
CLASS:PUBLIC
DTSTART;TZID="Europe/Berlin":20000128T100000
DTEND;TZID="Europe/Berlin":20000128T114500
LOCATION:Uni-Teil 3: Reichenhainer Str. 70\, Chemnitz (Zentr. Hörsaal- und Seminargebäude)
SUMMARY:Mechanical Strains and Stresses in RIE and Damascene Aluminum and Copper Interconnect Lines for 0.18 µm Logic Technologies (Fakultät für Elektrotechnik und Informationstechnik\, Zentrum für Mikrotechnologien)
DESCRIPTION:- Microprocessors with more than 20 million transistors\n- high-density interconnects\n- X-ray diffraction/ stress measurement\nPaul R. Besser\, Motorola-AMD Alliance Logic Technology\, Austin\, Texas\nDr. Seckel\, 531 3261
ORGANIZER:MAILTO:seckel@hrz.tu-chemnitz.de
UID:912@www.tu-chemnitz.de
CREATED:20000111T160400Z
DTSTAMP:20210802T203238Z
END:VEVENT
END:VCALENDAR