HLPH - Publication: ID[980] [ print ]  -  [ close ]
Author(s):
M. Melzer, T. Wächtler, St. Müller, H. Fiedler, S. Hermann, R.D. Rodriguez, A. Villabona, A. Sendzik, R. Mothes, S.E. Schulz, D.R.T. Zahn, M. Hietschold, H. Lang, T. Geßner

Source:
Microelectronic Engineering, 107 (2013) 223

Title:
Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications

Abstract:
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Type of Publication:
Refereed Journal

Year:
2013