Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging - Hofmann, Christian; Rochala, Patrick; Kroll, Martin; Panhale, Sushant; Baum, Mario; Kuhn, Harald; Oi, Kiyoshi; Sanada, Masaki; Murayama, Kei (2023 IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, 2023, pp. 137-140. - IEEE, 2023, 2023)