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Professorship Micromanufacturing Technology
Professorship Micromanufacturing Technology

Electrochemical Machining (ECM):

  • Microstructuring of metal components with closed electrolyte jet (Jet-ECM) or pulsed ECM (PECM)
  • Enables machining via turning, drilling, grinding, and cutting
  • Generation of functional surfaces to optimize the properties for friction and heat transfer as well as for the application of microfluids
  • Application of the CAD-CAM software, developed at UT Chemnitz

   

On 23 November, 2011, Dr. Matthias Hackert-Oschätzchen gave a talk on “Electricty as a Tool: Applications of ECM in Precision and Micromanufacturing” during the third industrial roundtable Chemnitz/Jena of the German Physical Society’s (Deutsche Physikalische Gesellschaft) research group for industry and economy. A recording of the talk can be found here. The video is 50 minutes long and has been optimized for Mozilla Firefox.

 

 

Content of the presentation:

The basic principle of all production-technological applications of the electrochemical machining (ECM) of metal consists of the anodic solution (electroshaping) of a metal component. On its boundary layer to a fluid ionic conductor (electrolyte), an abrasion of the component occurs due to the influence of electric charge transfer, without requiring mechanical contact to the cathode.

This principle allows for the includion of complex geometries into high-strength metal components. In addition to explaining the foundations of the ECM process, the presentation suggests industrial application areas and the respective differentiated variants of the ECM process.

Further, the presentation highlights current approaches to increasing the precision and effectiveness of this technology, focusing specifically on electrochemical abrasion with pulsed electric current and oscillating spark gap (PECM) as well as on the electrochemical abrasion with closed electrolyte freejet (Jet-ECM). The presentation not only talks about the applications of these techniques but also mentions the option of the process-oriented multiphysics simulation of EC technologies.

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