Publications
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Year 2020
Papers
| Gadhiya,G.; Kersjes,S.; Fernandes,F.; Rzepka,S.; Otto,T.: The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods. InterPACK Conference, Virtual Projekt: EuroPAT-MASiP, 2020 Oct 27-29; Proceedings (ISBN 978-0-7918-8404-1) |
| Gadhiya,G.; Kuisma,H.; Cardoso,A.; Braemer,B.; Rzepka,S.; Otto,T.: Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Virtual Projekt: EuroPAT-MASiP, Cracow (Poland), 2020 Jul 6-8; Proceedings (ISBN 978-1-7281-6049-8, 978-1-7281-6050-4) |
| Lange,S.; Schroeder,D.; Hedayat,C.; Hangmann,C.; Otto,T.; Hilleringmann,U.: Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000. 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome (Italy), 2020 Sep 23-25; Proceedings, pp 1-6 (ISBN 978-1-7281-5580-7) |
| Meinel,K.; Melzer,M.; Stoeckel,C.; Shaporin,A.; Forke,R.; Zimmermann,S.; Hiller,K.; Otto,T.; Kuhn,H.: 2D Scanning Micromirror with Large Scan Angle and Monolithically Integrated Angle Sensors Based on Piezoelectric Thin Film Aluminum Nitride. Sensors, 20, 22 (2020) p 6599 |
| Meinel,K.; Stoeckel,C.; Melzer,M.; Zimmermann,S.; Forke,R.; Hiller,K.; Otto,T.: Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride. IEEE Sensors Journal, p accepted |
| Otto,T.: A Platform for Fostering Industry-Academia Collaboration. AIMR Magazine. -Advances Institute for Materials Research (AIMR). 2020, pp 5-6 |
| Saeidi,N.; Kou,Y.; Selvam,K.; Baum,M.; Wiemer,M.; Otto,T.: Preliminary Simulation and Characterization of Capacitive Micromachined Ultrasonic Transducers (CMUT) for Targeted Cell Ablation Applications. BMT 2020, 54th Annual Conference of the German Society for Biomedical Engineering, , Online, 2020 29 Sep.- 1 Dec; Proceedings |
| Selbmann,F.; Baum,M.; Meinecke,C.; Wiemer,M.; Otto,T.; Joseph.Y.: (Invited) Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems. ECS Transactions, 98, 4 (2020) pp 55-66 |
