| Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants. 10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, Ostende (Belgium), 2010 Sep 20-22; Proceedings, pp 48-49 |
| Akiba,A.; Mitarai,S.; Morita,S.; Ikeda,I.; Kurth,S.; Leidich,S.; Bertz,A.; Nowack,M.; Froemel,J.; Gessner,T.: A fast and low actuation voltage MEMS switch for mm-wave and its integration. IEEE International Electron Devices Meeting, San Francisco (USA), 2010 Dec 6-8 pp 828-831 |
| Baum,M.; Jia,C.; Haubold,M.; Wiemer,M.; Schneider,A.; Rank,H.; Trautmann,A.; Gessner,T.: Eutectic Wafer Bonding for 3-D Integration. Electronic System-Integration Technology Conference (ESTC), 2010, Berlin, 2010 Sep 14-16; Proceedings, 3rd (2010) (ISBN 978-1-4244-8553-6) |
| Baum,M.; Vetter,C.; Haehnel,M.; Haenel,J.; Wiemer,M.; Gessner,T.: Mikrostrukturierung von dünnen Kunststofffolien durch Heißprägen. Technologien und Werkstoffe der Mikrosystem- und Nanotechnik, Darmstadt (Germany), 2010 May 10-11; GMM-Fachbericht, 65 (2010) pp 88-90 (ISBN 978-3-8007-3253-1) |
| Belsky,P.; Streiter,R.; Wolf,H.; Aubel,O.: Modeling of dielectric reliability in copper damascene interconnect systems under BTS conditions. Materials for Advanced Metallization (MAM 2010), Mechelen (Belgium), 2010 Mar 7-10 |
| Belsky,P.; Streiter,R.; Wolf,H.; Schulz,S.E.; Aubel,O.; Gessner,T.: Modeling of TDDB in advanced Cu interconnect systems under BTS conditions (Talk). Advanced Metallization Conference 2010, Albany, NY (USA), 2010 Oct 5-7 |
| Bonitz,J.; Hermann,S.; Kaufmann,C.; Gessner,T.: Technologie zur Integration von Kohlenstoffnanoröhren für Intertialsensoren.. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20 - 21 (ISBN 978-3-00-032052-1) |
| Ding,S.-F.; Xie,Q.; Waechtler,T.; Lu,H.-S.; Schulz,S.E.; Qu,X.-P.: Inhibition of enhanced Cu oxidation on ruthenium. 2010 International Interconnect Technology Conference (IITC), Burlingame, CA (USA), 2010 Jun 6-9; Proceedings, pp 1-3 (ISBN 978-1-4244-7676-3) |
| Fischer,T.; Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials (Talk). Advanced Metallization Conference, Albany, NY (USA), 2010 Oct 5-7 |
| Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.: NEMS/MEMS Integration for future One-chip mobile RF-systems. DFG workshop on nanoelectronics, Bad Honnef, 2010 Jan 17-19; proceedings |
| Gessner,T.; Vogel,M.: Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanosysteme.. LIFIS online (Internet-Zeitschrift des Leibniz-Instituts für interdisziplinäre Studien e.V. (LIFIS) (ISSN 1864-6972) |
| Gessner,T.; Vogel,M.; Hiller,K.; Otto,T.; Bertz,A.; Billep,D.: Challenges of Smart System Integration.. ECS Transaction, 27 (2010) pp 295 - 300 (ISSN 1938-6737) |
| Gessner,T.; Vogel,M.; Kaufmann,C.; Hiller,K.; Kurth,S.; Nestler,J.; Otto,T.: Micro/nano technologies towards smart systems integration.. 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Shanghai (China), 2010 Nov 1 - 4 (ISBN 978-1-4244-5797-7) |
| Gessner,T.; Vogel,M.; Otto,T.; Schulz,S.E.; Baumann,R.R.: Business Units and Core Competences of Fraunhofer ENAS
. Micromaterials and Nanomaterials
, 12 (2010) pp 4-7 (ISSN 1619-2486) |
| Gessner,T.; Vogel,M.; Schulz,S.E.; Wiemer,M.; Hiller,K.; Kurth,S.: Mikro- und Nanotechnologien für Smart Integrated Systems.. Industrie Management, 6 (2010) (ISBN 1434-1980, ISBN-13: 97839442183215) |
| Griffiths,C.A.; Bigot,S.; Brousseau,E.; Worgull,M.; Heckele,M.; Nestler,J.; Auerswald,J.: Polymer inserts tooling for prototyping of micro fluidic components in micro injection moulding. Int. J. Adv. Manuf. Technol., 47 (2010) p 111–123 (ISSN 0268-3768) |
| Hammerschmidt,J.; Eck,E.-M.; Sowade,E.; Jahn,S.F.; Ebert,S.; Morschhauser,A.; Goedel,W.A.; Baumann,R.: Complete Digital Fabrication of Polymeric Microsieves. NIP26: International Conference on Digital Printing Technologies and Digital Fabrication 2010, Austin, Texas, September 2010; Proceedings, 26 (2010) pp 538-540 |
| Hermann,S.; Fiedler,H.; Waechtler,T.; Falke,M.; Ecke,R.; Schulz,S.E.; Gessner,T.: Approaches for Fabrication of Carbon Nanotube Vias. Nanoelectronic Days 2010, Aachen (Germany), 2010 Oct 4-7; Poster presentation |
| Hermann,S.; Loschek,S.; Haibo,Y.; Bonitz,J.; Schulz,S.E.; Gessner,T.: Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen.. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, 2010 Oct 20 - 21 (ISBN 978-3-00-032052-1) |
| Hermann,S.; Pahl,B.; Ecke,R.; Schulz,S.E.; Gessner,T.: Carbon Nanotubes for Nanoscale low temperature flip chip connections.. Microelectronic Engineering, 87, 3 (2010) pp 438 - 442 |
| Hofmann,L.; Braeuer,J.; Baum,M.; Schulz,S.E.; Gessner,T.: Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration. AMC, Baltimore (USA), October 13-15, 2009; Proceeding of the Advanced Metallization Conference 2009, pp 241-251 (ISBN 987-1-60511-218-3) |
| Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations Regarding Through Silicon Via Filling for 3D Integration by Periodic Pulse Reverse Plating with and without Additives. Materials for Advanced Metallization (MAM), Mechelen (Belgium), 2010 Mar 7-10; Microelectron. Eng., (2010) p in press (DOI: 10.1016/j.mee.2010.07.004) (ISSN 0167-9317) |
| Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Pulse Reverse Electroplating for TSV Filling in 3D Integration. Smart Systems Integration, Como (Italy), 2010 Mar 23-24; Proceedings (ISBN 978-3-8007-3081-0) |
| Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik. Galvanotechnik, 08/2010 (2010) pp 1880-1884 (ISBN ISSN 0016-4232 B 20696) |
| Jakob,A.; Rueffer,T.; Ecorchard,P.; Walfort,B.; Koerbitz,K.; Fruehauf,J.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane copper(I) dicarboxylates: Synthesis and their potential use as precursors for the spin-coating process in the deposition of copper.. Zeitschrift für Anorganische und Allgemeine Chemie, 636, 11 (2010) pp 1931 - 1940 (ISSN 1521-3749) |
| Jakob,A.; Rueffer,T.; Schmidt,H.; Djiele,P.; Koerbitz,K.; Ecorchard,P.; Haase,T.; Kohse-Hoeinghaus,K.; Fruehauf,S.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Disilver(I) Coordination Complexes: Synthesis, Reaction Chemistry, and Their Potential Use in CVD and Spin-Coating Processes for Silver Deposition. Eur. J. Inorg. Chem., (2010) pp 2975-2986 (ISSN 1434-1948) |
| Jia,C.; Wiemer,M.; Reuter,D.; Hiller,K.; Gessner,T.: A Method for the Fabrication of Extra-Thin Silicon Substrates. Smart System Integration 2010, Milano, Italy, 2010 Mar 23-24 |
| Kuechler,M.; Hofmann,L.; Hahn,R.; Bertz,A.; Gessner,T.: Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE).. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20-21 (ISBN 978-3-00-032052-1) |
| Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Electronic transport properties of copper atomic wires. AMC, Baltimore, MD (USA), 2009 Oct 13-15; Proceeding of the Advanced Metallization Conference , XXV (2010) pp 127-130 |
| Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Geometry dependent of I-V characteristics of gold atomic-sized contacts. 9th IEEE Conference on Nanotechnology, Genoa (Italy), 2009 Jul 26-30 ; Proceeding of the IEEE-Nano, pp 884-884 (ISBN 978-1-4244-4832-6) |
| Mothes,R.; Shen,Y.; Jakob,A.; Walfort,B.; Rueffer,T.; Schulz,S.E.; Waechtler,T.; Gessner,T.; Lang,H.: Phosphite Copper(I)Trifluoroacetates [((RO)3P)mCuO2CCF3](m = 1, 2, 3): Synthesis, Solid State Structures and Their Use as CVD Precursors.. Dalton Transactions, 39, 46 (2010) pp 11235 - 11247 |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Auerswald,J.; Knapp,H.F.; Gavillet,J.; Gessner,T.: Polymer Lab-on-Chip systems with integrated electrochemical pumps suitable for large scale fabrication. Int. J. Adv. Manuf. Technol., 47, 1 (2010) pp 137-145 (ISSN 0268-3768) |
| Nestler,J.; Morschhauser,A.; Otto,T.; Koger,B; Brandenburg,A.; Wunderlich,K.; Ehrentreich-Foerster,E.; Bier,F.F.; Gessner,T.: Highly-integrated, low-cost in-vitro diagnostic platform for miniaturized assay development. MicroTAS, Netherlands, 2010; Proceedings, pp 1223-1225 (ISBN 978-0-9798064-3-8) |
| Nestler,J.; Otto,T.; Sommer,J.-P.; Michel,B.; Gessner,T.; Bier,F.F.: Self-contained microfluidic cartridges for in-vitro diagnostic
applications: Recent advances and improvements. Smart Systems Integration, Como (Italy), 2010 Mar 23-24; Proceedings |
| Nowack,M.; Reuter,D.; Bertz,A.; Kuechler,M.; Aurich,T.; Dittrich,C.; Gessner,T.: A Novel Three-Axis AIM Vibration Sensor for High Accuracy Condition Monitoring. IEEE Sensors 2010 Conference, Waikoloa (USA), 2010 Nov 1-4; Proceedings, pp 879-884 (ISBN 978-1-4244-8168-2) |
| Oszinda,T.; Schaller,M.; Dittmar,K.; Jinag,L.; Schulz,S.E.: How to evaluate surface free energies of dense and ultra low-k dielectrics in pattern structure.. ECS Transactions, 28, 2 (2010) pp 355 - 360 (ISSN 1938-6737) |
| Oszinda,T.; Schaller,M.; Fischer,D.; Walsh,C.; Schulz,S.E.: Investigation of physical and chemical property changes of ultra low-k SiOCH in aspect of cleaning and chemical repair processes.. Microelectronic Engineering, 87, 457 (2010) |
| Oszinda,T.; Schaller,M.; Leppack,S.; Schulz,S.E.: Restoration of plasma damaged porous ultra low-k SiOCH films: A coating process with UV activation versus a vapor phase process with thermal activation. Advanced Metallization Conference (AMC 2010), Albany, NY (USA), 2010 Oct 5 - 7; MRS Conference Proc.; Materials Research Society, pp 55 - 64 (ISBN 978-1-6051-1218-3, ISSN 1048-0854) |
| Oszinda,T.; Schaller,M.; Schulz,S.E.: Chemical Repair of Plasma Damaged Porous Ultra Low-k SiOCH Film Using a Vapor Phase Process. Journal of the Electrochemical Society, 157, 12 (2010) pp H1140 - H1147 (ISSN 0013-4651) |
| Otto,T.: Micro- and Nanotechnologies for Smart Systems. Micromaterials and Nanomaterials
, 12 (2010) pp 54-58 (ISSN 1619-2486) |
| Otto,T.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Gessner,T.: Picosecond Laser Micro-Machining as a versatile tool for prototyping in polymer and semiconductor based micro system technologies. ISL 2010 - International Symposium on Laser-Micromachining , Chemnitz, 2010 Oct 27-28 |
| Schueller,M.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: LEM Based Design Optimization of SJAs. Actuator 10, Bremen (Germany), 2010 June 14-16; Proceedings, pp 983-986 (ISBN 978-3-933339-12-6) |
| Schulz,S.E.; Gessner,T.: Neue Materialien und Technologien für Nanoelektronik und Sensorik. VµE, 40 (2010) p 16 |
| Schulze,K.; Jaschinsky,P.; Erben,J.; Gutsch,M.; Blaschta,F.; Freitag,M.; Schulz,S.E.; Steidel,K.; Hohle,C.; Gessner,T.; Kuecher,P.: Variable-Shaped E-Beam lithography
enabling process development for future copper
Damascene technology (Poster). 36th International Conference on Micro- and Nanoengineering (MNE), Genoa (Italy), 2010 Sept 19-22 |
| Tuchscherer,A.; Shen,Y.; Jakob,A.; Mothes,R.; Al-Anber,M.; Walfort,B.; Rueffer,T.; Fruehauf,S.; Ecke,R.; Schulz,S.E.; Gessner,T.; Lang,H.: Lewis-base Copper(I)Formates: Synthesis, Reaction Chemistry, Structural Characterization and Their Use as Spin-Coating Precursors for Copper Deposition. Inorganica Chimica Acta, 365, 2 (2010) pp 10 - 19 (ISSN 0020-1693) |
| Vogel,M.; Hiller,K.; Bertz,A.; Wiemer,M.; Gessner,T.: Smart Integrated Systems - Developments of Fraunhofer ENAS. Microsystems Technology in Germany 2010/Mikrosystemtechnik in Deutschland 2010, pp 18 - 19 (ISSN 2191-7183) |
| Voigt,S.; Tenholte,D.; Franke,D.; Reuter,D.; Hiller,K.; Gessner,T.; Mehner,J.: Gütebestimmung von MEMS-Strukturen im Zeitbereich mittels Laser Doppler Vibrometer und einem Logarithmierer. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20 - 21 (ISBN 978-3-00-032052-1) |
| Waechtler,T.; Ding,S.-F.; Hofmann,L.; Mothes,R.; Xie,Q.; Oswald,S.; Detavernier,C.; Schulz,S.E.; Qu,X.-P.; Lang,H.; Gessner,T.: ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. Materials for Advanced Metallization (MAM), Mechelen (Belgium), 2010 Mar 7-10 |
| Wolf,H.; Streiter,R.; Friedemann,M.; Belsky,P.; Bakaeva,O.; Letz,T.; Gessner,T.: Simulation of TaNx deposition by Reactive PVD. Microelectronic Eng., 87 (2010) p 1907–1913 (ISSN 0167-9317) |
| Wuensch,D.; Wiemer,M.; Gabriel,M; Gessner,T.: Low temperature wafer bonding for microsystems using dielectric barrier discharge. mst news, 1/10 (2010) pp 24-25 |
| Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Transport in carbon nanotubes: Contact models and size effects. IWEPNM 2010, Kirchberg (Austria), 2010 Mar 6-13; Phys. Status Solidi B, 247 (2010) p 3002–3005 (ISSN 0370-1972) |
| Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Electronic Transport in Carbon Nanotubes with Copper Contacts. Psi-k, Berlin (Germany), 2010 Sep 12-16; Poster presentation |
| Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Electronic Transport through Carbon Nanotubes with Metal Contacts. IWEPNM 2010, Kirchberg in Tirol (Austria), 2010 Mar 6-13; Poster presentation |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Ruelke,H.; Schulz,S.E.; Gessner,T.: Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS. MAM 2009, Grenoble (France), 2009 Mar 9-11; Microelectronic Engineering, 87 (2010) pp 337-342 (ISBN 0167-9317 (ISSN)) |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods. AMC, Baltimore (USA), October 13-15, 2009; Proceeding of the Advanced Metallization Conference 2009, pp 101-110 (ISBN 987-1-60511-218-3) |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma. Materials for Advanced Metallization MAM 2010, Mechelen (Belgium), 2010 Mar 7-10 |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Etch processes for dense and porous SiCOH materials: plasma states and process results. 3rd International Workshop Plasma Etch and Strip in Microelectronics, PESM 2010, Grenoble (France), 4-5 March 2010 |
| Zimmermann,S.; Ahner,N.; Fischer,T.; Schulz,S.E.; Gessner,T.: Talk: A combined Etch, Cleaning and k-restore Process for less damage integration of ultra low-k materials. SEMICON 2010, Dresden (Germany), October 19-21, 2010 |
