| Ahner,N.; Schulz,S.E.; Blaschta,F.; Rennau,M.: Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics. Materials for Advanced Metallization - MAM, Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84 (2007) pp 2606-2609 (ISSN 0167-9317) |
| Auerswald,J.; Niedermann,P.; Dias,F.; Keppner,H.; Bigot,S.; Beckers,M.-C.; Nestler,J.; Hiller,K.; Gessner,T.; Knapp,H.F.: Bonding of glass chip based SPR sensors to thermoplastic microfluidic scaffolds. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 153-160 (ISBN 978-3-8007-3009-4) |
| Baum,M.; Gessner,T.: Siliziumätzen schafft Sensibilität. Mikroproduktion, 1/2007 (2007) p 16 (ISBN ISSN 1614-4538) |
| Baum,M.; Gessner,T.: Das intelligente Produkt gewinnt. Mikroproduktion, 2/2007 (2007) pp 42-43 (ISBN ISSN 1614-4538) |
| Baum,M.; Letsch,H.; Shaporin,A.; Otto,T.; Gessner,T.: Development and Characterization of Cu to Cu bonding technology. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 427-429 (ISBN 978-3-8007-3009-4) |
| Baum,M.; Mann,M.; Ebling,F.; Keiper,B.; Haenel,J.; Otto,T.; Gessner,T.: Mikrostrukturierung von Kunststoffen durch Heißprägen und Laserablation. MST-Kongress 2007, Dresden (Deutschland), 2007 Okt. 15-17; Proceedings, VDE VERLAG GMBH, Berlin-Offenbach (2007), pp 623-626 (ISBN 978-3-8007-3061-2) |
| Baum,M.; Schaufuss,J.; Boese-Landgraf,J.; Otto,T.; Gessner,T.: Smart Hip Joint Implants. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 273-279 (ISBN 978-3-8007-3009-4) |
| Bertz,A.; Fendler,R.; Schuberth,R.; Hentsch,W.; Gessner,T.: A New Method for High-Rate Deep Dry Etching of Silicate Glass with Variable Etch Profile. Transducers07, Lyon (France), 2007 June 10-14; Digest of Technical Papers, pp 81-84 (ISBN 1-4244-0841-5) |
| Bleul,K.; Bonitz,J.; Haenel,J.; Kaufmann,C.; Keiper,B.; Mehner,J.; Petsch,T.: Laser Trimming of MEMS. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 581-583 (ISBN 978-3-8007-3009-4) |
| Bonitz,J.; Kaufmann,C.; Gessner,T.; Bundesmann,C.; Eichentopf,I.-M.; Maendl,S.; Neumann,H.: Hochreflektiver mikromechanischer Scanner für Materialbearbeitung und medizinische Anwendungen. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 513-516 (ISBN 978-3-8007-3061-2) |
| Ecke,R.; Rennau,M.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Influence of barrier crystallization on CV characteristics of MIS structures. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 123-128 (ISBN 1-55899-865-9 / ISSN 1048-0854) |
| Forke,R.; Scheibner,D.; Hiller,K.; Gessner,T.; Doetzel,W.; Mehner,J.: Spektrale Vibrationsmessung mit mikromechanischen kraftgekoppelten Silizium-Schwingern. 8. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2007 Nov 14-15; Proceedings, pp 67-72 (ISBN 978-3-00-022168-2) |
| Forke,R.; Scheibner,D.; Mehner,J.; Gessner,T.; Doetzel,W.: Adjustable Force Coupled Sensor-Actuator System for Low Frequency Resonant Vibration Detection. Transducers 07 - 14th International Conference on Solid-State Sensors, Actuators and Microsystems, Lyon (France), 2007 Jun 10-14; Proceedings, pp 1725-1728 (ISBN 1-4244-0841-5) |
| Froemel,J.; Zimmermann,S.; Wiemer,M.; Gessner,T.: Fabrication of SOI substrates with buried silicide layers for BICMOS-applications. Nano-Hetero System Integration, Sendai (Japan), 2007 Jul 30 |
| Fruehauf,S.; Gessner,T.; Haase,T.; Jakob,A.; Kohse-Hoeinghaus,K.; Lang,H.; Schulz,S.E.; Waechtler,T.: Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 531-533 (ISBN 978-3-8007-3009-4) |
| Gottfried,K.; Schubert,I.; Schulze,K.: CMP an Airgap basierten Interconnectsystemen. CMP Nutzertreffen, Duisburg, Apr 20 |
| Gottfried,K.; Schubert,I.; Schulze,K.; Schulz,S.E.; Gessner,T.: CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices. ICPT - International Conference on Planarization/CMP Technology, Dresden (Germany), 2007, Oct 25-27 pp 297-302 (ISBN 9783800730650) |
| Griffiths,C.A.; Bigot,S.; Brusseau,E.; Worgull,M.; Heckele,M.; Nestler,J.; Auerswald,J.: Polymer insert tooling for prototyping of micro fluidic components in micro injection moulding. 4M2007 - International Conference on Multi-Material Micro Manufacture, Borovets (Bulgaria), 2007 Oct 3-5; Proceedings, pp 305-308 (ISBN 978-1904445-53-1) |
| Hiller,K.; Nestler,J.; Gessner,T.; Gavillet,J.; Getin,S.; Quesnel,E.; Martin,S.; Delapierre,G.; Soechtig,J.; Voirin,G.; Buergi,L.; Auerswald,J.; Knapp,H.F.; Stanley,R.; Bigot,S.; Dimov,S.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.; Victor-Pujebet,E.: Integration aspects of a polymer based SPR biosensor with active micro optical and micro fluidic elements. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 295-302 (ISBN 978-3-8007-3009-4) |
| Hofmann,L.; Kuechler,M.; Gumprecht,T.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias
by copper electro depostition (Talk). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Iacopi,F.; Beyer,G.; Travaly,Y.; Waldfried,C.; Gage,D.M.; Dauskardt,R.H.; Houthoofd,K.; Jacobs,P.; Adriaensens,P.; Schulze,K.; Schulz,S.E.; List,S.; Carlotti,G.: Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure. Acta Materialia, 55(4) (2007) pp 1407-1414 |
| Jia,C.; Hiller,K.; Wiemer,M.; Otto,T.; Gessner,T.: Low-Temperature Ti-Si bonding and its application in micro-device fabrication. Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, Halle, 09.-11.12.2007 |
| Kolchuzhin,V.; Mehner,J.; Gessner,T.; Doetzel,W.: Application of Higher Order Derivatives Method to Parametric Simulation of MEMS. EuroSimE, London (England), 2007 Apr 16-18; Proceedings, pp 588-593 (ISBN 1-4244-1106-8) |
| Kurth,S.; Froemel,J.; Voigt,S.; Leidich,S.; Nestler,J.; Shaporin,A.; Doetzel,W.; Gessner,T.: Switch Arrangement with a Plurality of Switches arranged in the Form of a Matrix and Method for switching Switches arranged in the Form of a Matrix . Patentschrift WO002007104528A1, DE102006029024B3 |
| Leidich,S.; Hofmann,L.; Riemer,T.; Kurth,S.; Schubert,I.; Kaufmann,C.; Gessner,T.: Mikrospulen und RF-MEMS Varaktoren für die kernmagnetische Resonanzspektroskopie – Applikationen und Technologie. 8. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2007 Nov 14-15 (ISBN 978-3-00-022168-2) |
| Leidich,S.; Kurth,S.; Gessner,T.: Continuously Tunable RF-MEMS Varactor for High Power Applications. ISMOT, Rom, 2007 Dez 17-21 |
| Morschhauser,A.; Nestler,J.; Voigt,S.; Schueller,M.; Otto,T.; Gessner,T.: Permanentmagnetische Membranen für mikrofluidische Aktorik. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 813-815 (ISBN 978-3-8007-3061-2) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Auerswald,J.; Knapp,H.F.; Otto,T.; Gessner,T.: Fully integrated polymer based microfluidic pumps and valves in Lab-on-Chip systems for Point-of-Care use. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 565-568 (ISBN 978-3-8007-3009-4) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Bigot,S.; Auerswald,J.; Gavillet,J.; Otto,T.; Gessner,T.: Electrochemical microfluidic pumps based on super absorbing polymers. uTAS2007 - 11th Internationl Conference on Miniaturized Systems for Chemistry and Life Sciences, Paris (France), 2007 Oct 7-11; Proceedings, pp 1504-1506 (ISBN 978-09798064-0-7) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Gessner,T.: Polymer Lab-on-Chip systems with integrated electrochemical pumps. 4M2007 - International Conference on Multi-Material Micro Manufacture, Borovets (Bulgaria), 2007 Oct 3-5; Proceedings, pp 319-322 (ISBN 978-1904445-53-1) |
| Nowack,M.; Reuter,D.; Rennau,M.; Bertz,A.; Gessner,T.: Wafer-Level Active Testing of Capacitive Inertial Sensors. MicroNanoReliability, Berlin (Germany), 2007 Sep 2-5; Micromaterials and Nanomaterials, p 175 (ISSN 1619-2486) |
| Otto,T.; Morschhauser,A.; Nestler,J.; Voigt,S.; Gessner,T.: Verfahren und Vorrichtung zur Lokalisierung von Partikeln in Matrixwerkstoffen. Patentschrift (DE102007051977) |
| Otto,T.; Nestler,J.; Baum,M.; Schroeder,H.; Ebling,F.; Bruch,R.; Gessner,T.: Integrated polymer multimode waveguides for microfluidic sensing applications. Nanosensors, Microsensors, and Biosensors and Systems 2007, San Diego, USA, 18-22 March 2007; Proc. SPIE, 6528 (2007) pp U224-U231 (ISBN 978-0-8194-6649-5) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Fritzsch,U.; Gessner,T.: MEMS-based NIR-Spectrometers: The next generation of analytical instruments. The 7th International Conference on ASIC, Guillin, 2007 Oct 26-29 |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Forensische Untersuchungen mittels MEMS-Spektrometern. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17 pp 493-496 (ISBN 978-3-8007-3061-2) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Mikrospiegelspektrometer für den Nahinfraroten Spektralbereich – Applikationen & Trends. 8. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2007 Nov 14-15 pp 144-147 (ISBN ISBN 978-3-00-022168-2) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Miniaturisierung in der instrumentellen Analytik dank Mikrospiegeln. apv news, 2/07 (2007) pp 14-15 |
| Reuter,D.; Bertz,A.; Gessner,T.: Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 597-599 (ISBN 978-3-8007-3009-4) |
| Reuter,D.; Bertz,A.; Werner,T.; Nowack,M.; Gessner,T.: Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer. Transducers07, Lyon (F), 2007 Jun 11-14; Tech. Digest |
| Roth,N.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane copper(I) complexes as CVD precursors. Surf. Coat. Technol., 201 (22-23) (2007) pp 9089-9094 (ISSN 0257-8972) |
| Rudra,S.; Friedrich,M.; Louis,S.; Gordan,O.; Waechtler,T.; Zahn,D.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. 71st Annual Meeting of the Deutsche Physikalische Gesellschaft and DPG Spring Meeting of the Division Condensed Matter, Regensburg (Germany), 2007 Mar 26-30 |
| Rudra,S.; Friedrich,M.; Louis,S.J.; Waechtler,T.; Himcinschi,C.; Zahn,D.R.T.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. 4th International Conference on Spectroscopic Ellipsometry, Stockholm (Sweden), 2007 Jun 11-15 |
| Saupe,R.; Otto,T.; Weiss,A.; Stock,V.; Gessner,T.: Packaging aspects of MEMS-based optical systems. Smart Systems Integration, Paris, 2007 Mar 27-28 pp 605-607 (ISBN 978-3-8007-3009-4) |
| Schuberth,R.; Otto,T.; Schwerdtner,R.; Bach,D.; Wegener,M.; Gessner,T.: Demonstration des Einsatzes flächiger low-cost-Sensoren am Beispiel eines trainingsunterstützenden Tischtennisschlägers. Mikrosystemtechnik-Kongress MST 2007, Dresden (Germany); Proceedings, pp 1087-1090 |
| Schulz,S.E.; Ahner,N.: Deposition and properties of porous ultra-low-k dielectric films (Invited Talk). 8th Seminar Porous Glasses - Special Glasses, Wroclaw, 2007 Sept 4-8 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Impact of Dielectric Material and Metal Arrangement on Thermal Behaviour of Interconnect Systems. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 445-451 (ISBN 1-55899-865-9 / ISSN 1048-0854) |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Thermal Behavior of Interconnect Systems: A Comparison of low-k, Airgap and SiO2 Integration (Talk). MicroNanoReliability, Berlin, 2007 Sept 2-5 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Electrical characterization of Airgap structures: Impact of film thickness and film permittivity on effective dielectric constant (Talk). European Congress on Advanced Materials and Processes EUROMAT, Nuernberg, 2007 Sept 10-13 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation. Materials for Advanced Metallization (MAM), Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84/11 (2007) pp 2587-2594 |
| Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.: Reproduciple reliable AuSi eutectic wafer bond process with high yield. IMECE2007, Seattle
(USA), 2007 Nov 11-15 |
| Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.: Improvement of solid Au-Si eutectic bond process. Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, 09.-11.12.2007 |
| Schwerdtner,R.; Otto,T.; Schuberth,R.; Bach,D.; Wegener,M.; Danz,R.; Gessner,T.: Flexible taktile Sensorarrays auf Basis verschiedener piezoelektrischer Funktionspolymere. Mikrosystemtechnik-Kongress MST 2007, Dresden(Germany), 2007 Oct 15-17; Proceedings, pp 155-158 |
| Shaporin,A.; Hanf,M.; Forke,R.; Mehner,J.; Gessner,T.; Doetzel,W.: Test-Structure based MEMS Characterization Technique. Smart Systems Integration 2007, Paris (France), 2007 Mar 27-28; Proceedings, pp 625-627 (ISBN 978-3-8007-3009-4) |
| Thieme,T.; Bertz,A.; Gessner,T.; Dittrich,C.: Neue Technologie in der Herstellung – neue Chance am Markt. Mikrosystemtechnik-Kongress, Dresden (Germany), 2007 Oct 15-17; Proceedings, pp 135-138 (ISBN 978-3-8007-3061-2) |
| Voigt,S.; Morschhauser,A.: PDMS-Membran mit partiell verteilten Magnetpartikeln für Schalteranwendungen. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 809-812 (ISBN 978-3-8007-3061-2) |
| Waechtler,T.; Jakob,A.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Copper thin films grown via ALD of copper oxide. European Congress on Advanced Materials and Processes - EUROMAT, Nuremberg (Germany), 2007 Sep 10-13 |
| Waechtler,T.; Oswald,S.; Pohlers,A.; Schulze,S.; Schulz,S.E.; Gessner,T.: Copper and copper oxide composite films deposited by ALD on
tantalum-based diffusion barriers (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Waechtler,T.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Composite films of copper and copper oxide deposited by ALD
. AVS 7th International Conference on Atomic Layer Deposition - ALD 2007, San Diego, California (USA), 2007 Jun 24-27 |
| Waechtler,T.; Schulz,S.E.; Oswald,S.; Gessner,T.: Atomic Layer Deposition of Copper and Copper Oxide for Applications in Microelectronic Metallization Systems. NanoScience 2007 - 5th Leibniz Conference of Advanced Science, Lichtenwalde (Germany), 2007 Oct 18-20; Micromaterials and Nanomaterials, Iss. 07/2007 (2007) pp 26-27 (ISSN 1619-2486) |
| Wiemer,M.; Froemel,J.; Hiller,K.; Reuter,D.; Jia,C.: Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele. Technologien und Werkstoffe der Mikro- und Nanosystemtechnik, Karlsruhe, 07.-08. Mai 2007; GMM-Fachbericht , 53 (2007) pp 17-24 |
| Zimmermann,S.; Q.T.Zhao; H.Hoehnemann; Wiemer,M.; Kaufmann,C.; S.Mantl; V.Dudek; Gessner,T.: Roughness improvement of the CoSi2/Si-interface for an application as buried silicide. Material for Advanced Metallization MAM 2007, Bruges (Belgium), March 4-7 |
