Chemnitz University of Technology, Faculty of Mechanical Engineering, Chair in Micromanufacturing Technology: Faculty of Mechanical Engineering: Chair Micromanufacturing Technology: DFG - SFB/TR 39 - PT-PIESA

Microstructuring and Integration Technology for Piezo Fibers in Metallic Carrier Materials

07/06 to 06/14

Deutsche Forschungsgemeinschaft (German Research Foundation)

Prof. Dr.-Ing. Andreas Schubert

Dipl.-Ing. Benedikt Müller

In this part, the center of interest is the development and testing of new microstructuring technologies for aluminum carriers. The microstructures involved are to guarantee a load-compatible integration of piezo elements. The carriers to structure preferably are 1mm thin aluminum-sheet metals. By means of special forming techniques (stamping, punching) assembly-compatible joining cavities (e.g. U- or V-grooves) with defined substructures (chamfers, installation structure, auxiliary and spring bars) are to be joined to the carrier material. From today's view these precise microgeometries will have a size of 20 x 0, 20 x 0, 20 mm³. Accordingly, laws of yielding of the carrier material that significantly determine the molding accuracy need to be explored for the sheet-like stamping or punching of the microstructures. Limiting parameters of the used precision method need to be sounded. The carrier material is to be mechanically loaded as constantly as possible through the microforming process. The produced structure geometries shall enable the following subprocesses passivation/isolation, integration of the piezo elements and the contacting of the composite. Additional substructures in the cavities are to allow a durable fixation of the piezo elements in the carrier material. Depending on the construction option as presented in SP C1, the microstructures are to be coating-compatible and mechanically resilient. Moreover, they are insisted on causing different friction properties between piezo element and the construction substance. For the production of such microstructures, a suitable structure geometry, stamping tools and process sequences need to be designed and tested.