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R. Schacht, D. May, B. Wunderle, O. Wittler, A. Gollhardt, B. Michel and H. Reichl
Characterization of Thermal Interface Materials to Support Thermal Simulation.
Proc. 12th Therminic 2006, Sep 27-29, Nice, Côte d'Azur, France, 2006.
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M. Dressler, H. Rohde, G. Liebing, K.-F. Becker, B. Wunderle and H. Reichl
Influence of Assembly Process, Material Properties and Geometry on the Reliability of Flip Chip Interconnections on MID for Automotive Applications.
Proc. 7th MID Congress, Sep 27-28, Fürth, Germany, 2006
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T. Braun, B. Wunderle, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner and H. Reichl
Improved Reliability Of Leadfree Flip Chip Assemblies Using Direct Underfilling By Transfer Molding.
Proc. 31st IEMT, Nov 8-10, 2006, Putrajaya, Malaysia
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R. Schacht, D. May, B. Wunderle, O. Wittler, A. Gollhardt, B. Michel and Reichl
Characterization of Thermal Interface Material.
Proc. 1st ESTC 2006, Sep 5-7, 2006, Dresden, Germany, pp 1367-1373, 2006
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B. Wunderle and B. Michel
Progress in Reliability Research in the Micro and Nano Region.
Journal of Microelectronics Reliability, Elsevier, 46/9-11, pp 1685-1694, 2006
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M. Dressler, K.-F. Becker, B. Wunderle, H. Rohde, J. Auersperg, G. Liebing and H. Reichl
Identifying the reliability-affecting parameters of SBB Flip-Chip Interconnections for Automotive Applications.
Proc. 1st ESTC, Sep 5-7, 2006, Dresden, Germany 2006
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E.D. Dermitzaki, J. Bauer, B. Wunderle, B. Michel
Diffusion of water in amorphous polymers at different temperatures using molecular dynamics simulation.
Proc. 1st ESTC, Sep 5-7, 2006, Dresden, Germany 2006
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R. Schacht, E. Auerswald, J.P. Sommer, B. Wunderle, B. Michel and H. Reichl
Accelerated Active High-Temperature Cycling Test for Power MOSFETs.
Proc. Itherm 2006, May 30 - June 2, San Diego, USA, 2006
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S. Déplanque, W. Nüchter, B. Wunderle, R. Schacht and B. Michel
Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis.
Proc. 7th EuroSimE Conf., Como, Italy, April 2006
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F. Schindler-Saefkow, D. May, B. Wunderle, R. Schacht, B. Michel
3D-PCB-Packaging Technology for High Power Applications with Water Cooling.
ACTUATOR 2006, June 14, Bremen, Germany, 2006
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Reithmeier, E.; Frühauf, J., Rahlves M.; Kraft, A.; Seifert, M.
Heißprägen multifunktionaler Kalibriernormale für die optische 3D Mikroskopie
VDI-Berichte Nr. 1950 Messtechnik für Mikro- und Nano-Engineering, S. 35-44, VDI Verlag GmbH, Düsseldorf 2006
ISSN: 0083-5560
ISBN: 3-18-091950-7
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Gärtner, E.; Frühauf, J.
Silizium-Normale für die Tiefen- Längen- und Rauheitsmesstechnik
VDI-Berichte Nr. 1950 Messtechnik für Mikro- und Nano-Engineering, S. 25-34, VDI Verlag GmbH, Düsseldorf 2006
ISSN: 0083-5560
ISBN: 3-18-091950-7