The integration of microelectronic components into hybrid structures allows for the functionalisation by
sensors, actuators and electronics, and thus, the further improvement of the performance and functional
density of hybrid components. Innovative continuous manufacturing technologies for active systems based on
micro- and also nanoeffects offer special advantages that enable the integration of functional elements into
semi-finished products and preforms. In order to achieve the reliable integration of additional
functionality, methods for the design and integration of active transducer elements in lightweight
structures will be developed. The final goal is to enable the components to exhibit their intrinsic
actuatory and sensory effect. A combination of in-situ and inline processes, including injection moulding
with functionalised textile layers for electrical contacting and mass print technology will be used. Due to
an increased use of FRP components for the reduction of energy consumption in mobile applications, the
condition monitoring of these lightweight structures is of increasing importance. One highly innovative
approach is that of in-situ functionalisation during production by using inmould-coating techniques and
integration of nanocrystal-based sensor films. The integration of transducers and electronics into
load-adapted FRP components requires novel interconnection, attachment and housing technologies. The major
research objectives are the performance and reliability of signal transfer from hybrid structures to sensors
and actuators, as well as the energy supply and response data linkage regarding cost-efficient production
processes.
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Figure: In-situ Plastics Processes, Smart Systems Integration - Making preforms smarter by
integration of new functionalities into hybrid structures
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Investigators:
Baumann,
Götze,
Lang,
Michel,
Zahn
Subprojects of the IRD D
| IRD D1 |
Design methods and technologies for the integration of electronic functional elements into
heterogeneous composites
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| IRD D2 |
Technologies for embedding foil-based sensors and generators
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| IRD D3 |
Technology for the integration of metamaterials for power transfer and communication
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| IRD D4 |
Technologies for the integration of miniaturised silicon sensor systems for failure detection in
hybrid components
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